Circuit Board High Current Applications - LeitOn-Cu400 thick copper boards

Current applications require a specific copper buildup for PCBs above the common 35µ. Buidups of 70µ and 140µ have been the industry standard for a long time. Copper thickness above 210µm creates substantial problems for many producers. But even this is not sufficient in the expanding high performance area with extreme flows on smaller Printed Circuit Boards (PCB).

For this reason LeitOn provides you with high-quality printed circuit boards with a copper buildup of up to 400µ! Your advantages are:

Cost savings
Life span, reliability and degree of integration substantially increase.

Optimal heat discharge
Next to silver copper possess the best thermal conduction coefficient.

Heat management at the source
Regardless if hot spots or entire PCB tracks - due to the high copper layer heat distributes in the best possible way allowing targeted diversion.

Overview of LeitOn-Cu400 Competencies:

Circuit boards of up to 2 layers

Individual copper buildup of up to 400µ

Solder mask included

Through hole plating (PTH) inculded (copper thickness about 50µ)

LeitOn-Cu400 - Explanations
The high copper layer allows reliable heat diversion and provides additional safty for high current applications as well as heat sensitive components.

Material	Thermal conduction coefficient in W/mk
Silver	429
Copper	398
Aluminum	234
Epoxy resin	7,5 - 9
Water	0,6
Air	0,02
(Please refer to our table for common thermal conduction coefficients)

Copper thickness and technical requirements
Special provions should be taken during the circuit board design. For example, greater circuit path allowance and width as well as different drill diameters and their annular ring sizes need to be considered..

Coper- layer	Min. Drill diameter	Min. Drill pad (drills +)	Min. Track spacing	Min. Track- width
35µ	0,30mm	0,30mm	0,15mm	0,15mm
70µ	0,30mm	0,40mm	0,20mm	0,20mm
105µ	0,35mm	0,50mm	0,40mm	0,40mm
140µ	0,40mm	0,60mm	0,50mm	0,50mm
210µ	0,50mm	0,80mm	0,70mm	0,70mm
300µ	0,50mm	1,60mm	0,70mm	0,90mm
400µ	0,50mm	2,00mm	0,70mm	1,20mm

Furthermore, the following needs to be considered:
Under-etching may lead to a decrease the conductive path width. Example: up to -0,10mm for single PCB tracks (400µ coper thickness)

Alternatives and inquiries
For alternative heat management with pressed aluminum core please refer to "LeitOn-ALU".

For inquiries relating to this topic "LeitOn-ALU" please email .

LeitOn - Professional solutions for individual challenges

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