Printed Circuit Board production (PCB production)

The Printed Circuit Board (PCB) production requires many different steps in fields of mechanical, galvanic and chemical processes. The complete process of Printed Circuit Board production (PCB production) for a double layer PCB is as follows: (For detailed information of each process please click on the links)

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1. Incoming order
2. Data inspection
3. Files okay?
4. Call back customer
5. CAM preparation
6. Prepare operation chart
7. Plot films
8. >2 layers
9. Cut (package)
10. Drill
11. Deburring (scrubbing)
12. Laminate photo resist
13. Laminate etch resist
14. Etching
15. Strip etch resist
16. Inspection
17. Solder mask
18. Surface finishing
19. Silk print
20. Produce screen for silk print
21. Print silk print
22. Electrical test
23. Okay
24. Final routing
25. Final inspection
26. Dissapprove
27. Packing/shipment
28. Inner layers
29. Inner layer inspection
30. Activate surface
31. Layer stack-up and pressing
32. Etch back epoxy resin and desmear
33. Through hole plating (PTH)
34. Copper build-up

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The processes in Printed Circuit Board production (PCB production) can be divided into further processes. The industrial PCB production of a simple double layer PCB amounts to around 100 single steps.

A simple process chart about PCB production, you can find here.

You can download the flowchart of the PCB production process as a *.PDF document.

Downloads:
PCB production process (3,5 MB)
Flowchart of the production process (154 KB)