| Options and Characteristics - Rigid Printed Circuits - PCBs | Online calculation | on explicit enquiry |
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| Quantity | 1 piece up to 0,4m² total area | from 1 piece |
| Layer quantity | 1 to 8 layers | up to 18 layers |
| Material thickness (1 and 2 layers) | 0,5mm; 0,8mm; 1,0mm; 1,2mm; 1,55mm; 2,0mm and 2,4mm | 0,10mm* to 3,0mm *see flexible printed circuits (FPC) |
| Material thickness (4, 6 and 8 layers) | 1,55mm | 0,2mm* bis 3,2mm *see flexible printed circuits (FPC) |
| Copper thickness (1 and 2 layers) | 35µm and 70µm | 35µm, 70µm, 105µm, 140µm, 210µm, 280µm, 400µm |
| Copper thickness (4, 6 and 8 layers) | 35µm | 12µm to 210µm |
| Material colour | beige / fawn | black, blue, white |
| Base material type | FR4 Tg 130° C | several Rogers HF, Isola high-Tg etc. (please enquire our stock) |
| Maximum operating temperature | ca. 110° C | up to ca. 230° C (Tg 260) |
| Minimum operating temperature | ca. -40° C | down to ca. -40° C |
| Silk print layer | none, top, bottom, double sided | none, top, bottom, double sided |
| Solder mask colour | green, white, black, blue, red and yellow | green, white, black, blue, red, yellow and transparent (individual colours on exact colour value - RAL scale) |
| Silk print colour | white | black, blue, yellow, red |
| Via-Filling (no copper lid) | possible | possible |
| Electric test | possible (flying probe) | possible, also adapter |
| Plugging (with copper lid, e.g. for "via-in-pad technology" | not possible | possible |
| Peelable mask | top, bottom or double sided | top, bottom or double sided |
| Beveling | not possible | possible |
| Surface finish | HAL lead free, immersion tin, immersion gold, RoHS compliant (means one of the three surface finishs, chosen by LeitOn) | HAL lead free, immersion tin, immersion gold, OSP (ENTEK), immersion silver, HAL lead, RoHS compliant (means one of the three surface finishs, chosen by LeitOn) |
| Finger gold | not possible | possible |
| Long term tempering | not possible | possible |
| Maximum printed circuit board size 1 and 2 layers PCB | 280 x 480mm | 1200 x 500mm |
| Maximum printed circuit board size for multilayer PCBs | 280 x 480mm | 500 x 600mm |
| Minimum singulated circuit board size | 3cm², smaller can be calculated but will be paneliyed | >1cm² <3cm² on enquiry |
| Minimum circuit boar size in v-cut panels | 5x5mm | <5x5mm auf Anfrage |
| Minimum circuit boar size in routing panels | 10x10mm, bzw. 1cm² | <10x10mm on enquiry |
| Minimum printed circuit board width | 5mm | <5mm on enquiry |
| Lead time options 1 and 2 layers printed circuits | 12 hours, 2WD, 3WD, 5WD, 7WD, 8WD, 9WD, 12WD, 15WD, 18WD, 25WD | In-day-service and over-night-service |
| Lead time options 4 to 8 layers multilayer printed circuits | 2WD, 4WD, 6WD, 7WD, 9WD, 10WD, 12WD, 15WD, 18WD, 25WD | Over-night-service and 2WD |
| Lead time options 10 to 18 layers multilayer printed circuits | not possible | from 6WD |
| Routing | always | always, except punching |
| V-cut | possible | possible |
| Jump-v-cut | not possible | possible |
| Punching | not possible | possible |
| Counter-sink-holes | not possible | possible |
| Z-axis milling | not possible | possible |
| Multilayer special stack-up | not possible | possible |
| PTH-drills (plated drills) - Rigid Printed Circuit Boards - PCBs | Online calculation | on explicit enquiry |
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| Smallest drill 35µm (final diameter) | 0,20mm, stadard is 0,30mm | 0,15mm |
| Smallest drill 70µm (final diameter) | 0,30mm | 0,20mm |
| Smallest drill 105µm (final diameter) | not possible | 0,30mm |
| Smallest drill 140µm (final diameter) | not possible | 0,30mm |
| Smallest drill 210µm (final diameter) | not possible | not possible |
| Smallest drill 210µm (final diameter) | not possible | 0,40mm |
| Smallest drill 210µm (final diameter) | not possible | 0,50mm |
| Smallest annular ring 35µm | 0,15mm | 0,10mm |
| Smallest annular ring 70µm | 0,20mm | 0,15mm |
| Smallest annular ring 105µm | not possible | 0,20mm |
| Smallest annular ring 140µm | not possible | 0,25mm |
| Smallest annular ring 210µm | not possible | 0,30mm |
| Smallest annular ring 280µm | not possible | 0,50mm |
| Smallest annular ring 400µm | not possible | 1,00mm |
| Possibel drill diameters | 0,20mm to 5,5mm in 0,05mm steps | 0,15mm to 5,5mm in 0,05mm steps |
| Drills >5,5mm | are routed | are routed |
| Smallest drill distance 0,20mm to 2,00mm hole size (drill edge to drill edge) | 0,40mm | 0,40mm |
| Smallest drill distance 2,05mm to 5,50mm hole size (drill edge to drill edge) | 0,50mm | 0,50mm |
| Intersecting drills | not possible, will be routed | 1,0mm to 2,0mm |
| Half-open PTH on PCB edge | not possible | possible |
| NPTH-drills (non-plated drills) - Rigid Printed Circuit Boards - PCBs | Online calculation | on explicit enquiry |
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| Smalles drill size (final diameter) | 0,60mm | 0,30mm |
| Possible drill sizes | 0,60mm to 5,5mm in 0,05mm steps | 0,60mm to 5,5mm in 0,05mm steps |
| Copper clearance / distance to copper | 0,20mm | 0,20mm |
| Drills >5,5mm | are routed | are routed |
| Minimum drill-to-edge distance | 0,50mm | 0,50mm |
| Smallest drill distance 0,20mm to 2,00mm hole size (drill edge to drill edge) | 0,40mm | 0,40mm |
| Smallest drill distance 2,05mm to 5,5mm hole size (drill edge to drill edge) | 0,50mm | 0,50mm |
| Intersecting drills | not possible, will be routed | 1,0mm to 2,0mm |
| NPTH drills in copper area (without clearance) | not possible (will be cleared from copper by min. 0,2mm) | on explicit requirement only |
| Copper Layers (outer) - Rigid Printed Circuit Boards - PCBs | Online calculation | on explicit enquiry |
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| Smallest trace 18µm | not possible | 0,09mm |
| Smallest trace 35µm | 0,10mm; 0,125mm or 0,15mm | 0,10mm |
| Smallest trace 70µm | 0,20mm | 0,15mm |
| Smallest trace 105µm | no | 0,40mm |
| Smallest trace 140µm | not possible | 0,50mm |
| Smallest trace 210µm | not possible | 0,70mm |
| Smallest trace 280µm | not possible | 0,90mm |
| Smallest trace 400µm | not possible | 1,20mm |
| Smallest trace-to-trace distance 18µm | not possible | 0,09mm |
| Smallest trace-to-trace distance 35µm | 0,10mm; 0,125mm or 0,15mm | 0,10mm |
| Smallest trace-to-trace distance 70µm | 0,20mm | 0,15mm |
| Smallest trace-to-trace distance 105µm | not possible | 0,40mm |
| Smallest trace-to-trace distance 140µm | not possible | 0,50mm |
| Smallest trace-to-trace distance 210µm | not possible | 0,60mm |
| Smallest trace-to-trace distance 280µm | not possible | 0,70mm |
| Smallest trace-to-trace distance 400µm | not possible | 0,80mm |
| Smallest drill pad | 0,50mm bei 0,20mm Bohrungen, Standard ist 0,60mm | 0,38mm |
| Smallest copper clearance to inner routing | 0,30mm | 0,25mm or 0,0mm (plated) |
| Smallest copper clearance to board edge (routing) | 0,30mm | 0,25mm or 0,0mm (plated) |
| Smallest copper clearance to board edge (v-cut) | 0,50mm | 0,40mm |
| Tolerances, Values, Marks & Norms - Rigid Printed Circuit Boards - PCBs | Online calculation | on explicit enquiry |
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| Max. offset drill centre to centre of reference | 0,07mm | 0,05mm |
| Max. offset soldermask / copper structures | 0,12mm | 0,075mm |
| Finished drill sizes PTH (<=0,50mm) | 0,15/+0,15mm | -0/+0,10 |
| Finished drill sizes PTH (0,55 to 3mm) | -0/+0,20mm | -0/+0,10mm |
| Finished drill sizes PTH (>3mm) | -0,05/+0,20mm | -0/+0,10mm |
| Finished drill sizes NPTH (up to 6mm) | -0,05/+0,20mm | -0/+0,10mm |
| Finished drill sizes NPTH (>6mm) | -0,05/+0,20mm | -0/+0,10mm |
| Outline | +/-0,20mm | +/-0,10mm |
| Max. offset outline/copper structures | +/-0,15mm | +/-0,10mm |
| V-cut depth | +/-0,30mm | +/-0,20mm |
| Z-axis milling | not possible | +/-0,20mm |
| V-Cut position to copper structures | +/-0,25mm | +/-0,15mm |
| Etch tolerance copper thickness 18µm | not possible | +0/-0,02mm |
| Etch tolerance copper thickness 35µm | +0/-0,03mm | +0/-0,03mm |
| Etch tolerance copper thickness 70µm | +0/-0,05mm | +0/-0,05mm |
| Etch tolerance copper thickness 105µm | not possible | +0/-0,08mm |
| Etch tolerance copper thickness 140µm | not possible | +0/-0,10mm |
| Etch tolerance copper thickness 210µm | not possible | +0/-0,12mm |
| Etch tolerance copper thickness 280µm | not possible | +0/-0,12mm |
| Etch tolerance copper thickness 400µm | not possible | +0/-0,25mm |
| Material thickness tolerances | <=1,0mm: +/-15%
>1,0mm: +/-10%
1,55mm: 1,6mm +/-10% | differs, please enquire |
| Copper thickness tolerances | +20% / -15% | +/-10% |
| Immersion tin thickness | >=0,7µm | >=1,0µm |
| HAL lead free thickness | >= 8- bis 10µm, Kanten >0,5µm | >= 8- bis 10µm, Kanten >0,5µm |
| HAL lead thickness | not possible | >= 8- bis 10µm, edges >0,5µm |
| Immersion gold for soldering (nickel thickness | 2,5µm to 5µm | 3µm to 6µm |
| Immersion gold for soldering (gold thickness) | 0,05µm to 0,075 µm | 0,07µm to 0,12 µm |
| Immersion gold for gold-wire bonding (nickel thickness) | not possible | 3µm to 6µm |
| Immersion gold for gold-wire bonding (gold thickness) | not possible | 0,4µm to 6µm |
| Immersion gold for aluminum-wire bonding (nickel thickness) | 2,5µm to 5µm | 3µm to 6µm |
| Immersion gold for aluminum-wire bonding (gold thickness) | 0,05µm bis 0,075 µm | 0,07µm bis 0,12 µm |
| Electrolytic connector gold - soft, bonding possible (nickel thickness) | not possible | 4µm to 8µm |
| Electrolytic connector gold - soft, bonding possible (gold thickness) | not possible | 0,3µm to 5µm |
| Electrolytic connector gold - hard, bonding NOT possible (nickel thickness) | not possible | 4µm to 8µm |
| Electrolytic connector gold - hard, bonding NOT possible (gold thickness) | not possible | 0,8µm to 5µm |
| Wet solder laquer thickness | >15µm | >15µm |
| Copper thickness in plated hole, traces 35µm | minimum 20µm | minimum 20µm |
| Copper thickness in plated hole, traces 70µm | minimum 20µm | minimum 20µm |
| Copper thickness in plated hole, traces 105 to 210µm | not possible | minimum 25µm |
| hickness in plated hole, traces 280 to 400µm | not possible | minimum 30µm |
| Winding | max. 1% | max. 0,5% |
| Warping | max. 1% | max. 0,5% |
| Beveling angle | not possible | no spcification, please enquire |
| Base materials RoHS-compliance | yes, always | yes, always |
| Surface finish RoHS-compiance | yes, always | always, unless "HAL lead" is explicitly required |
| IPC-norm | IPC-A-600G - Class 2 | IPC-A-600G - Class 1, 2 or 3 |
| UL-approval of printed circuits (UL number, logo, date code) | UL94V0 possible | UL94V0 possible |
| UL-approved base material | yes, always | possible |
| Insertion of date code | possible, please mention in enquiry | possible, please mention in enquiry |
| Insertion of supplier logo (LeitOn) | possible, please mention in enquiry | possible, please mention in enquiry |
| DIN EN ISO 9001 certification work preparation, CAM and order management over LeitOn | yes | yes |
| DIN EN ISO 9001 certification of printed circuit board production | no | possible |
| DIN EN ISO 14001 certification of printed circuit board production | no | possible |
| DIN EN ISO 16949 certification of printed circuit board production | no | possible |
Smallest solder mask web (straight)
Smallest solder mask web (round)
smallest solder maks size around copper
