Tool for calculation of heat transmission and temperatures of aluminum printed circuits (PCB)

For this calculation the size of the heat emitting component and its heating power are required. Both is usually mentioned in technical data sheets of the component. You may choose any value for copper, aluminum and prepreg characteristics or you refer to the list of standardized components from LeitOn below.

Calculation of heat transmission for aluminum printed circuits (PCBs with heat emitting components)
Project name:
Contact area	mm2 (of heat emitting component)
Heat emitting power	W (of component)

	Thickness of substrates	Thermal conductivity
Copper	µm	W/mK
Isolation/prepeg	µm	W/mK
Aluminum carrier	µm	W/mK
Temperature difference	°C *

* No responsibility is taken for the correctness of this information.

Note: the smaller the temperature difference, the better the heat transmission capabilities of the selected aluminum PCB stack-up are.

Please consider that an exact calculation of thermal transmissions depends on several other factors which cannot be considered in a simplified tool. These factors mainly derive from the layout design such as copper distribution, component alignment or geometric shapes of the heat emitting component. Thus, this tool only offer a guidance and its results may differ from actual measurements.

Note: Prepregs thickness of less than 150µm may cause higher costs. For price-optimized designs of your aluminum printed circuits you should also consider an isolation thickness of 150µm.