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Design Rules for
Rigid Printed Circuits - PCB

Rigid Printed Circuits

Downloads

NameTypeSizeDownload
Technology - Rigid Printed Circuits - Rev 2.7(141,50 KB, PDF)PDF141 KB Download
Layer Stack-ups - Rigid FR4 Circuit Boards - Rev 5.0(858,40 KB, PDF)PDF858 KB Download
Standard Multilayer – Selected Impedances(568,41 KB, PDF)PDF568 KB Download

Options and Characteristics - Rigid Printed Circuits - PCBsOnline calculationon explicit enquiry
Quantity 1 piece up to 2,5m² total area from 1 piece up to mass production with on-call orders
Layer quantity 1 to 14 layers up to 24 layers
Material thickness (1 and 2 layers) 0,5mm; 0,8mm; 1,0mm; 1,2mm; 1,55mm; 2,0mm and 2,4mm 0,10mm* to 3,0mm *see flexible printed circuits (FPC)
Material thickness (up to 14 layers multilayer) several, up to 2,4mm 0,2mm* to 4,2mm *see flexible printed circuits (FPC)
Copper thickness (1 and 2 layers) 35µm, 70µm and 105µm 35µm, 70µm, 105µm, 140µm, 210µm, 280µm, 400µm
Copper thickness (up to 14-layer multilayers) 35µm, partially 70µm and 105µm 12µm to 210µm
Material colour beige / fawn black, blue, white
Base material type FR4 Tg ≥130° C; FR4 Tg 170° C several Rogers HF, Isola high-Tg etc. (please enquire our stock)
Maximum operating temperature ca. 110° C / ca. 150° C up to ca. 230° C (Tg 260)
Minimum operating temperature ca. -40° C down to ca. -40° C
Silk print layer none, top, bottom, double sided none, top, bottom, double sided
Solder mask colour green, white, black, blue, red green, white, black, blue, red and transparent (individual colours on exact colour value - RAL scale)
Silk print colour white black, blue, yellow, red
Via-Filling (no copper lid) possible possible
Electric test possible (flying probe) possible, also adapter
Plugging (with copper lid, e.g. for "via-in-pad technology" possible possible
Peelable mask top, bottom or double sided top, bottom or double sided
Bevelling possible possible
Surface finish HAL lead free, immersion tin, immersion gold (ENIG and ENEPIG), RoHS compliant (means one of the three surface finishs, chosen by LeitOn) HAL lead free, immersion tin, immersion gold (ENIG and ENEPIG), OSP (ENTEK), immersion silver, HAL lead, RoHS compliant (means one of the three surface finishs, chosen by LeitOn)
Connector gold possible possible
Long term tempering not possible possible
Maximum printed circuit board size 1 and 2 layers PCB 430 x 370 mm² 1200 x 500 mm²
Maximum printed circuit board size for multilayer PCBs 430 x 370 mm² 500 x 600 mm²
Minimum singulated circuit board size 3cm², smaller can be calculated but will be paneliyed >1cm² <3cm² on enquiry
Minimum circuit board size in v-cut panels 5 x 5 mm²  
Minimum circuit boar size in routing panels 10 x 10 mm², bzw. 1cm²  
Minimum printed circuit board width 5mm  
Lead time options 1 and 2 layers printed circuits 12 hours, 2WD, 3WD, 5WD, 7WD, 8WD, 9WD, 12WD, 15WD, 18WD, 25WD In-day-service and over-night-service
Lead time options 4 to 8 layers multilayer printed circuits 2WD, 3WD, 4WD, 6WD, 7WD, 9WD, 10WD, 12WD, 15WD, 18WD, 25WD Over-night-service
Lead time options 10 to 14 layers multilayer printed circuits 3WD, 4WD, 5WD, 8WD, 12WD from 2WD
Lead time options 16 to 24 layers multilayer printed circuits not possible from 3WD
Routing always always, except punching
V-cut possible possible
Jump-v-cut possible possible
Punching not possible possible
Counter-sink-holes not possible possible
Z-axis milling not possible possible
Multilayer special stack-up not possible possible
Panel Production - Rigid Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
V-cut panel possible possible
V-Cut - Routing panel (combination) possible possible
Multi panels (more than one layout per panel) not possible possible
Panel setup (chosen by LeitOn) possible possible
Panel setup (according to drawing) possible possible
PTH-drills (plated drills) - Rigid Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Smallest drill 35µm (final diameter) 0,10mm, standard is 0,30mm 0,10mm
Smallest drill 70µm (final diameter) 0,10mm 0,10mm
Smallest drill 105µm (final diameter) 0,10mm 0,10mm
Smallest drill 140µm (final diameter) not possible 0,30mm
Smallest drill 210µm (final diameter) not possible not possible
Smallest drill 280µm (final diameter) not possible 0,40mm
Smallest drill 400µm (final diameter) not possible 0,50mm
Smallest annular ring 35µm 0,15mm 0,10mm
Smallest annular ring 70µm 0,15mm 0,12mm
Smallest annular ring 105µm 0,15mm 0,15mm
Smallest annular ring 140µm not possible 0,25mm
Smallest annular ring 210µm not possible 0,30mm
Smallest annular ring 280µm not possible 0,40mm
Smallest annular ring 400µm not possible 0,50mm
Possibel drill diameters 0,20mm to 5,5mm in 0,05mm steps 0,15mm to 5,5mm in 0,05mm steps
Drills >5,5mm are routed are routed
Smallest drill distance 0,20mm to 2,00mm hole size (drill edge to drill edge) 0,40mm 0,40mm
Smallest drill distance 2,05mm to 5,50mm hole size (drill edge to drill edge) 0,50mm 0,20mm
Intersecting drills not possible, will be routed 1,0mm to 2,0mm
Half-open PTH on PCB edge not possible possible
NPTH-drills (non-plated drills) - Rigid Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Smallest drill size (final diameter) 0,60mm 0,30mm
Possible drill sizes 0,60mm to 5,5mm in 0,05mm steps 0,15mm to 5,5mm in 0,05mm steps
Copper clearance / distance to copper 0,20mm 0,20mm
Drills >5,5mm are routed are routed
Minimum drill-to-edge distance 0,50mm 0,50mm
Smallest drill distance 0,20mm to 2,00mm hole size (drill edge to drill edge) 0,40mm 0,20mm
Intersecting drills not possible, will be routed 1,0mm to 2,0mm
NPTH drills in copper area (without clearance) not possible (will be cleared from copper by min. 0,2mm) on explicit requirement only
Blind Vias - Rigid Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Smallest blind via (final diameter) 0,30mm to 0,50mm, depending on stack-up and required layer connection 0,30mm
Smallest Aspect-Ratio 1 1
Smallest annular ring 0,15mm 0,125mm
Buried Vias - Rigid Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Smallest buried via (final diameter) 0,30mm 0,10mm
Routing (non-plated) - Rigid Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Inner routing NPTH possible possible
Smallest inner routing NPTH 0,70mm 0,70mm
Available routing diameters NPTH up to 2,0mm in 0,10mm steps up to 2,2mm in 0,10mm steps
Smallest radius (inner corners) NPTH 0,35mm 0,35mm
Routing (plated) - Rigid Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Inner routing PTH partly possible possible
Smallest inner routing PTH (final diameter) 0,60mm 0,60mm
Edge plating (outer edge) not possible possible
Special routing paths with plating (inner) partly possible possible
Available routing diameters PTH (final diameter) up to 1,9mm in 0,10mm steps up to 1,9mm in 0,10mm steps
Smallest radius (inner corner, final) PTH 0,30mm 0,30mm
Smallest annular ring 0,20mm 0,20mm
Copper Layers (outer) - Rigid Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Smallest trace 18µm not possible 0,07mm
Smallest trace 35µm 0,10mm; 0,125mm or 0,15mm 0,08mm
Smallest trace 70µm 0,20mm 0,15mm
Smallest trace 105µm 0,25mm 0,20mm
Smallest trace 140µm not possible 0,30mm
Smallest trace 210µm not possible 0,60mm
Smallest trace 280µm not possible 0,80mm
Smallest trace 400µm not possible 1,20mm
Smallest trace-to-trace distance 18µm not possible 0,09mm
Smallest trace-to-trace distance 35µm 0,10mm; 0,125mm or 0,15mm 0,10mm
Smallest trace-to-trace distance 70µm 0,20mm 0,15mm
Smallest trace-to-trace distance 105µm 0,25mm 0,20mm
Smallest trace-to-trace distance 140µm not possible 0,40mm
Smallest trace-to-trace distance 210µm not possible 0,60mm
Smallest trace-to-trace distance 280µm not possible 0,70mm
Smallest trace-to-trace distance 400µm not possible 0,80mm
Smallest drill pad 0,50mm bei 0,20mm Bohrungen, Standard ist 0,60mm 0,38mm
Smallest copper clearance to inner routing 0,25mm 0,15mm or 0,0mm (plated)
Smallest copper clearance to board edge (routing) 0,25mm 0,15mm or 0,0mm (plated)
Smallest copper clearance to board edge (v-cut) 0,40mm 0,30mm
Copper Layers (inner) - Rigid Multilayer Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Smallest trace 18µm not possible 0,08mm
Smallest trace 35µm 0,10mm; 0,125mm or 0,15mm 0,10mm
Smallest trace 70µm 0,20mm 0,15mm
Smallest trace 105µm 0,25mm 0,25mm
Smallest trace-to-trace distance 18µm not possible 0,08mm
Smallest trace-to-trace distance 35µm 0,10mm; 0,125mm or 0,15mm 0,08mm
Smallest trace-to-trace distance 70µm 0,20mm 0,15mm
Smallest trace-to-trace distance 105µm 0,25mm 0,20mm
Smallest drill-pad diameter 0,60mm 0,40mm
Smallest copper clearance to outer edges (routed) 0,30mm 0,25mm
Smallest copper clearance to inner edges (routed) 0,30mm 0,25mm
Smallest copper clearance to drills 0,30mm 0,25mm
Solder Mask - Rigid Multilayer Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Smallest solder mask web (green, straight) 0,12mm 0,10mm
Smallest solder mask web (non-green, straight)
0,15mm 0,15mm
Smallest solder mask web (round) 0,075mm 0,05mm
smallest solder mask size around copper 0,075mm <0mm
Smallest text lines 0,25mm 0,20mm
Silk Print - Rigid Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Smallest lines 0,20mm 0,15mm
Smallest distance between lines 0,20mm 0,15mm
Minimum clearance to copper pads 0,20mm 0,15mm
Carbon Print - Rigid Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Smallest pad-to-pad distance not possible 0,50mm
Tolerances, Values, Marks & Norms - Rigid Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Max. offset drill centre to centre of reference 0,07mm 0,05mm
Max. offset solder mask / copper structures 0,12mm 0,075mm
Finished drill sizes PTH (up to 3mm) +/-0,10mm +/-0,05mm
Finished drill sizes PTH (>3mm <5,5mm) +/-0,12mm +/-0,10mm
Finished drill sizes NPTH (up to 5,5mm) +/-0,12mm +/-0,075mm
Finished drill sizes PTH & NPTH (>5,5mm - routed) +/-0,20mm +/-0,125mm
Outline +/-0,20mm +/-0,125mm
Max. offset outline/copper structures +/-0,15mm +/-0,10mm
V-cut depth +/-0,30mm +/-0,20mm
Z-axis milling not possible +/-0,05mm
V-Cut position to copper structures +/-0,25mm +/-0,15mm
Etch tolerance copper thickness 18µm not possible +0/-0,02mm
Etch tolerance copper thickness 35µm +0/-0,03mm +0/-0,03mm
Etch tolerance copper thickness 70µm +0/-0,05mm +0/-0,05mm
Etch tolerance copper thickness 105µm +0/-0,07mm +0/-0,07mm
Etch tolerance copper thickness 140µm not possible +0/-0,10mm
Etch tolerance copper thickness 210µm not possible +0/-0,12mm
Etch tolerance copper thickness 280µm not possible +0/-0,12mm
Etch tolerance copper thickness 400µm not possible +0/-0,25mm
Material thickness tolerances <=1,0mm: +/-15%
>1,0mm: +/-10%
1,55mm: 1,6mm +/-10%
differs, please enquire
Copper thickness tolerances +20% / -15% +/-10%
Immersion tin thickness >=0,7µm >=1,0µm
HAL lead free thickness >= 8- bis 10µm, Kanten >0,5µm >= 8- bis 10µm, Kanten >0,5µm
HAL lead thickness not possible >= 8- bis 10µm, edges >0,5µm
ENIG - Immersion gold for soldering (nickel thickness) 2,5µm to 5µm 3µm to 6µm
ENIG - Immersion gold for soldering (gold thickness) 0,05µm to 0,075 µm 0,07µm to 0,12 µm
ENEPIG - Immersion nickel-palladium-gold for gold-wire bonding (nickel thickness) 4µm to 8µm 4µm to 8µm
ENEPIG - immersion nickel-palladium-gold for for gold-wire bonding (palladium thickness) 0,1µm to 0,3µm 0,1µm to 0,3µm
ENEPIG - imersion nickel-palladium-gold for gold-wire bonding (gold thickness) 0,02µm to 0,08µm 0,02µm to 0,08µm
Immersion gold for gold-wire bonding (nickel thickness) not possible 3µm to 6µm
Immersion gold for gold-wire bonding (gold thickness) not possible 0,4µm to 6µm
Immersion gold for aluminum-wire bonding (nickel thickness) 2,5µm to 5µm 3µm to 6µm
Immersion gold for aluminum-wire bonding (gold thickness) 0,05µm bis 0,075 µm 0,07µm bis 0,12 µm
Electrolytic connector gold - soft, bonding possible (nickel thickness) not possible 4µm to 8µm
Electrolytic connector gold - soft, bonding possible (gold thickness) not possible 0,3µm to 5µm
Electrolytic connector gold - hard, bonding NOT possible (nickel thickness) 4µm to 8µm 4µm to 8µm
Electrolytic connector gold - hard, bonding NOT possible (gold thickness) 1,0µm 0,8µm to 5µm
Wet solder laquer thickness >15µm >15µm
Copper thickness in plated hole, traces 35µm minimum 20µm minimum 20µm
Copper thickness in plated hole, traces 70µm or 105µm minimum 20µm minimum 20µm
Copper thickness in plated hole, traces 140 to 210µm not possible mindestens 25µm
Copper thickness in plated hole, traces 280 to 400µm not possible minimum 30µm
Winding max. 1% max. 0,5%
Warping max. 1% max. 0,5%
Bevelling angle 30°, 45°, 60° 30°, 45°, 60°
Base materials RoHS-compliance yes, always yes, always
Surface finish RoHS-compiance yes, always always, unless "HAL lead" is explicitly required
IPC-norm IPC-A-600G - Class 2 IPC-A-600G - Class 1, 2 or 3
UL-approval of printed circuits (UL number, logo, date code) UL94-V0 possible UL94-V0 possible
UL-approved base material yes, always possible
Insertion of date code possible, please mention in enquiry possible, please mention in enquiry
Insertion of supplier logo (LeitOn) possible, please mention in enquiry possible, please mention in enquiry
DIN EN ISO 9001 certification of printed circuit board production yes yes
DIN EN ISO 14001 certification of printed circuit board production yes yes
DIN EN ISO 16949 certification of printed circuit board production no possible