Printed Circuit Board production (PCB production)

The Printed Circuit Board (PCB) production requires many different steps in fields of mechanical, galvanic and chemical processes. The complete process of Printed Circuit Board production (PCB production) for a double layer PCB is as follows: (For detailed information of each process please click on the links)

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  1. Incoming order
  2. Data inspection

    The check of the PCB layout files is commonly known as the design rules check (DRC). First, the PCB layout is checked for completeness. Second, the relevant characteristics for the PCB production are checked and may be corrected. For example, the following are checked during DRC:

    • Pads cantered to drills "snap pads".
    • Check annular rings of copper around the drills.
    • Smallest drill size according to technology.
    • Check trace width/gaps according to capabilities or ordered technology range. Standard is 6mil-Technology (ca. 0,15mm). Sometimes 4mil and smaller is required.
    • Swell traces for etching, to avoid diminution during PCB production.
    • Separation of plated (PTH) and non-plated drills (NPTH) into different drill programs.
    • Clear routing or V-cut outlines from copper areas to avoid burr.
    • General plausibility check (any trace intersections, missing drills etc.)
    • Swell solder mask (mostly bigger than copper pads) and close too small distances.
    • Check outline for breaks, insert panel breakaways and set different routing tools.
    • Optimize drill and routing path to save time during PCB production.

  3. Files okay?
  4. Call back customer
  5. CAM preparation
  6. Prepare operation chart
  7. Plot films
  8. >2 layers
  9. Cut (package)
  10. Drill
  11. Deburring (scrubbing)
  12. Laminate photo resist
  13. Laminate etch resist
  14. Etching
  15. Strip etch resist
  16. Inspection
  17. Solder mask
  18. Surface finishing
  19. Silk print
  20. Produce screen for silk print
  21. Print silk print
  22. Electrical test
  23. Okay
  24. Final routing
  25. Final inspection
  26. Dissapprove
  27. Packing/shipment
  28. Inner layers
  29. Inner layer inspection
  30. Activate surface
  31. Layer stack-up and pressing
  32. Etch back epoxy resin and desmear
  33. Through hole plating (PTH)
  34. Copper build-up
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The processes in Printed Circuit Board production (PCB production) can be divided into further processes. The industrial PCB production of a simple double layer PCB amounts to around 100 single steps.

A simple process chart about PCB production, you can find here.
Leiterplattenherstellung

You can download the flowchart of the PCB production process as a *.PDF document.

Downloads:
PCB production process (3,5 MB)
Flowchart of the production process (154 KB)
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