PCB Heat Resistance

Calculate heat resistance and temperatures for heat emitting components on aluminum PCBs. A must for efficient heat-management!

Tool for calculation of heat transmission and temperatures of aluminum printed circuits (PCB)

Calculation of heat transmission for aluminum printed circuits
(PCBs with heat emitting components)

This tool calculates heat transmission of components on aluminum based printed circuits (PCB).

For this calculation the size of the heat emitting component and its heating power are required. Both is usually mentioned in technical data sheets of the component. You may choose any value for copper, aluminum and prepreg characteristics or you refer to the list of standardized components from LeitOn below.

Name	Isolation thickness (prepreg) [µm]	Thermal conductivity (prepreg) [W/mK]	Available copper thickness [µm]	Available aluminum thickness [mm]	Remarks
Polytherm TC-Lam 1.3	100	1,3	35, 70	1,0; 1,5; 2,0;	available online
Polytherm TC-Lam 3.0	100	3,0	35; 70	1,0; 1,5; 2,0	available online
Berqquist HT	75	2,2	35; 70; 105	1,5; 2,0	only partly on stock, only 1 layer, high cost
Berqquist MP	75	1,3	35; 70; 105	1,5	only partly on stock, only 1 layer, high cost
CAF Aluminium-2L	100; 150	1,3; 2,0; 3,0	35; 70	1,0; 1,5; 2,0	on stock, plated through, mass production or prototypes

Tool - PCB Heat Resistance

Project name:

Contact area:

mm² (of heat emitting component)

Heat emitting power

W (of component)

Thickness of substrates

Copper

µm

Isolation/prepeg

µm

Aluminum carrier

µm

Thermal conductivity

Copper

= W/mK

Isolation/Prepeg

= W/mK

Aluminum carrier

= W/mK

Temperature difference

°C

* No responsibility is taken for the correctness of this information.

Note: the smaller the temperature difference, the better the heat transmission capabilities of the selected aluminum PCB stack-up are.

Please consider that an exact calculation of thermal transmissions depends on several other factors which cannot be considered in a simplified tool. These factors mainly derive from the layout design such as copper distribution, component alignment or geometric shapes of the heat emitting component. Thus, this tool only offer a guidance and its results may differ from actual measurements.