Tool for calculation of heat transmission
and temperatures of aluminum printed circuits (PCB)
This tool calculates heat transmission of components on aluminum based printed circuits (PCB).
For this calculation the size of the heat emitting component and its heating power are required. Both is usually mentioned in technical data sheets of the component. You may choose any value for copper, aluminum and prepreg characteristics or you refer to the list of standardized components from LeitOn below.
* No responsibility is taken for the correctness of this information.
Note: the smaller the temperature difference, the better the heat transmission capabilities of the selected aluminum PCB stack-up are.
Please consider that an exact calculation of thermal transmissions depends on several other factors which cannot be considered in a simplified tool. These factors mainly derive from the layout design such as copper distribution, component alignment or geometric shapes of the heat emitting component. Thus, this tool only offer a guidance and its results may differ from actual measurements.
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| Name | Isolation thickness (prepreg) [µm] | Thermal conductivity (prepreg) [W/mK] | Available copper thickness [µm] | Available aluminum thickness [mm] | Remarks |
|---|---|---|---|---|---|
| Polytherm TC-Lam 1.3 | 100 | 1,3 | 35, 70 | 1,0; 1,5; 2,0; | available online |
| Polytherm TC-Lam 3.0 | 100 | 3,0 | 35; 70 | 1,0; 1,5; 2,0 | available online |
| Berqquist HT | 75 | 2,2 | 35; 70; 105 | 1,5; 2,0 | only partly on stock, only 1 layer, high cost |
| Berqquist MP | 75 | 1,3 | 35; 70; 105 | 1,5 | only partly on stock, only 1 layer, high cost |
| CAF Aluminium-2L | 100; 150 | 1,3; 2,0; 3,0 | 35; 70 | 1,0; 1,5; 2,0 | on stock, plated through, mass production or prototypes |
