Design Rules for
Copper IMS Printed Circuits

Design Rules forCopper IMS Printed Circuits

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NameTypeSizeDownload
Standard Base Material(61,21 KB, PDF)PDF61 KB Download
Layer Stack-up - Copper-IMS-PCBs - Rev. 1.0 (31,96 KB, PDF)PDF32 KB Download

Options and Characteristics - Copper-IMS-Printed Circuits - PCBsOnline calculationon explicit enquiry
Quantity 1 piece up to 1,0m² total area from 1 piece to mass production
Layer quantity 1 layer up to 6 layers
Material thickness (1-layer) 1,6mm 0,80mm to 4,0mm
Material thickness (2-layers) not possible 1,8mm
Material thickness (4- to 6-layers) not possible 2,0mm to 4,0mm
Copper thickness (1- and 2-layers) 35µm 35µm, 70µm, 105µm
Copper thickness (4- to 6-layers) not possible 35µm, 70µm, 105µm
Dielectric thickness 60µm 60 to 200µm
Material colour beige or brown prepreg / copper beige or brown prepreg / copper
Base material type copper / Isolation: FR4 Tg 170° C copper / Isolation: FR4 Tg 170° C
Maximum operating temperature ca. 150° C ca. 150° C
Silk print layer none, top none, top, bottom, double sided
Solder mask colour green, white, black, blue and red green, white, black, blue, red and transparent (individual colours on exact colour value - RAL scale)
Silk print colour white, black respectively on white solder mask black, blue, yellow, red
Via-Filling (no copper lid) not possible possible
Electric test included finger-test or adapter
Plugging (with copper lid, e.g. for "via-in-pad technology" not possible possible
Peelable mask not possible top, bottom or double sided
Beveling not possible possible
Surface finish immersion tin, immersion gold (ENIG) immersion tin, immersion gold (ENIG or ENEPIG), OSP
Finger gold not possible not possible
Long term tempering not possible possible
Maximum copper-IMS-printed circuit board size 1 and 2 layers IMS-copper PCB 270 x 430mm 420 x 580 mm²
Maximum copper-IMS-printed circuit board size for copper-IMS multilayer PCBs not possible 230 x 360mm²
Minimum copper-IMS singulated circuit board size 3cm², smaller can be calculated but will be panelized >1cm² <3cm² on enquiry
Minimum copper-IMS circuit boar size in v-cut panels not possible  <10x10mm² on enquiry
Minimum copper-IMS circuit boar size in routing panels 10x10mm² / 1cm² <5x5mm² on enquiry
Minimum copper-MS printed circuit board width 5mm <5mm on="" enquiry="" td="">
Lead time options 1 layer copper-IMS printed circuits 2WD, 3WD, 5WD, 7WD In-day-service and over-night-service
Lead time options 2-ayers copper-IMS multilayer printed circuits not possible starting at 4WD
Lead time options 4- to 6 layers multilayer printed circuits not possible starting at 5WD
Routing always always
V-cut possible possible
Jump-v-cut possible possible
Punching not possible not possible
Counter-sink-holes not possible possible
Z-axis milling not possible possible
Aluminium-IMS special stack-up not possible possible
Panel Production - Copper-IMS Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
V-cut panel not possible possible
V-Cut - ALU routing panel (combination) not possible possible
Multi panels (more than one layout per panel) possible possible
Panel setup (chosen by LeitOn) possible possible
Panel setup (according to drawing) possible possible
PTH-drills (plated drills) - Copper-IMS-Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Smallest drill 35µm (final diameter) PTH not possible (only 1-layer) 0,10mm
Smallest drill 70µm (final diameter) PTH not possible (only 1-layer) 0,30mm
Smallest drill 105µm (final diameter) PTH not possible (only 1-layer) 0,30mm
Smallest annular ring 35µm PTH not possible (only 1-layer) 0,20mm
Smallest annular ring 70µm PTH not possible (only 1-layer) 0,20mm
Smallest annular ring 105µm PTH not possible (only 1-layer) 0,20mm
Possibel drill diameters PTH not possible (only 1-layer) 0,30mm to 2,2mm in 0,05mm steps
Drills >5,5mm PTH not possible (only 1-layer) routed
Smallest drill distance 1-layer copper-IMS-circuits (drill edge to drill edge) PTH not possible (only 1-layer) 0,40mm
Smallest drill distance 2-layers copper-IMS-circuits (drill edge to drill edge) PTH not possible (only 1-layer) 0,80mm
Intersecting drills PTH not possible (only 1-layer) not possible, will be routed
Half-open PTH on PCB edge PTH not possible (only 1-layer) not possible
NPTH-drills (non-plated drills) - Copper-IMS-Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Smalles drill size (final diameter) 1,0mm 0,30mm
Possible drill sizes 1,0mm to 5,5mm in 0,05mm steps 0,30mm to 5,5mm in 0,05mm steps
Copper clearance / distance to copper 0,20mm 0,20mm
Drills >5,5mm routed routed
Minimum drill-to-edge distance 0,50mm 0,50mm
Smallest drill distance 1-layer copper-IMS-circuits (drill edge to drill edge) 0,40mm 0,40mm
Smallest drill distance 2-layers copper-IMS-circuits (drill edge to drill edge) not possible 0,70mm
Intersecting drills not possible, will be routed not possible, will be routed
NPTH drills in copper area (without clearance) not possible (will be cleared from copper by min. 0,2mm) on explicit requirement only
Blind Vias - Copper-IMS-Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Smallest blind via (final diameter) not possible 0,30mm
Smallest Aspect-Ratio not possible 1:1
Smallest annular ring not possible 0,10mm
Buried Vias - Copper-IMS-Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Smallest buried via (final diameter) not possible possible
Routing (non-plated) - Copper-IMS-Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Inner routing NPTH possible possible
Smallest inner routing NPTH 2,0mm 1,0mm
Available routing diameters NPTH 2,0mm 2,0mm
Smallest radius (inner corners) NPTH 1,0mm 0,5mm
Routing (plated) - Copper-IMS-Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Inner routing PTH not possible possible
Smallest PTH inner routing (final diameter) not possible 2,0mm
Edge plating (outer edge) not possible not possible
Special routing paths with plating (inner) not possible possible
Available routing diameters PTH (final diameter) not possible 2,0mm
Smallest radius (inner corner, final) PTH not possible 1,0mm
Smallest annular ring not possible 0,20mm
Copper Layers (outer) - Copper-IMS-Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Smallest trace 35µm 0,15mm 0,10mm
Smallest trace 70µm not possible 0,15mm
Smallest trace 105µm not possible 0,40mm
Smallest trace-to-trace distance 35µm 0,15mm 0,10mm
Smallest trace-to-trace distance 70µm not possible 0,15mm
Smallest trace-to-trace distance 105µm not possible 0,40mm
Smallest drill pad drill siez +0,30mm drill size +0,20mm
Smallest copper clearance to inner routing 0,30mm 0,25mm 
Smallest copper clearance to board edge (routing) 0,30mm 0,25mm 
Smallest copper clearance to board edge (v-cut) not possible 0,50mm
Copper Layers (inner) - Copper-IMS-Multilayer Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Smallest trace 35µm not possible 0,10mm
Smallest trace 70µm not possible 0,15mm
Smallest trace 105µm not possible not possible
Smallest trace-to-trace distance 35µm not possible 0,10mm
Smallest trace-to-trace distance 70µm not possible 0,20mm
Smallest trace-to-trace distance 105µm not possible not possible
Smallest drill-pad diameter not possible 0,60mm
Smallest copper clearance to outer edges (routed) not possible 0,30mm
Smallest copper clearance to inner edges (routed) not possible 0,30mm
Smallest copper clearance to drills not possible 0,30mm
Solder Mask - Aluminium-IMS-Multilayer Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Smallest solder mask web (straight) 0,12mm 0,10mm
Smallest solder mask web (straight)
0,15mm 0,15mm
Smallest solder mask web (round) 0,075mm 0,05mm
smallest solder maks size around copper 0,075mm <0mm
Smallest text lines 0,25mm 0,20mm
Silk Print - Copper-IMS-Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Smallest lines 0,20mm 0,15mm
Smallest distance between lines 0,20mm 0,15mm
Minimum clearance to copper pads 0,20mm 0,15mm
Carbon Print - Copper-IMS-Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Smallest pad-to-pad distance not possible 0,30mm
Tolerances, Values, Marks & Norms - Copper-IMS-Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Max. offset drill centre to centre of reference 0,10mm 0,05mm
Max. offset soldermask / copper structures 0,15mm 0,075mm
Finished drill sizes PTH (<=0,50mm) not possible -0/+0,10
Finished drill sizes PTH (0,55 to 3mm) not possible -0/+0,10mm
Finished drill sizes PTH (>3mm) not possible -0/+0,10mm
Finished drill sizes NPTH (up to 6mm) -0,05/+0,20mm -0/+0,10mm
Finished drill sizes NPTH (>6mm) -0,05/+0,20mm -0/+0,10mm
Outline +/-0,20mm +/-0,10mm
Max. offset outline/copper structures +/-0,20mm +/-0,10mm
V-cut depth not possible +/-0,20mm
Z-axis milling not possible +/-0,20mm
V-Cut position to copper structures not possible +/-0,15mm
Etch tolerance copper thickness 35µm +0/-0,03mm +0/-0,03mm
Etch tolerance copper thickness 70µm +0/-0,05mm +0/-0,05mm
Etch tolerance copper thickness 105µm not possible +0/-0,08mm
Material thickness tolerances +/-10% differs, please enquire
Copper thickness tolerances +20% / -15% +/-10%
Immersion tin thickness >1µm >1µm
HAL lead free thickness >= 8- bis 10µm, edges >0,5µm >= 8- bis 10µm, edges >0,5µm
HAL lead thickness not possible not possible
Immersion gold for gold-wire bonding (nickel thickness), ENEPIG not possible 3µm to 6µm
Immersion gold for gold-wire bonding (gold thickness), ENEPIG not possible 0,025µm to 0,05 µm
Immersion gold for aluminum-wire bonding (nickel thickness), ENIG 3µm to 6µm 3µm to 6µm
Immersion gold for aluminum-wire bonding (gold thickness), ENIG 0,05µm to 0,12 µm 0,05µm to 0,12 µm
Electrolytic connector gold - soft, bonding possible (nickel thickness) not possible not possible
Electrolytic connector gold - soft, bonding possible (gold thickness) not possible not possible
Electrolytic connector gold - hard, bonding NOT possible (nickel thickness) not possible not possible
Electrolytic connector gold - hard, bonding NOT possible (gold thickness) not possible not possible
Wet solder laquer thickness >15µm >15µm
Copper thickness in plated hole, traces 35µm minimum 18µm minimum 20µm
Copper thickness in plated hole, traces 70µm not possible minimum 20µm
Copper thickness in plated hole, traces 105 to 210µm not possible minimum 20µm
hickness in plated hole, traces 280 to 400µm not possible minimum 20µm
Winding max. 1% max. 0,5%
Warping max. 1% max. 0,5%
Beveling angle not possible not possible
Base materials RoHS-compliance yes, always yes, always
Surface finish RoHS-compiance yes, always always, unless "HAL lead" is explicitly required
IPC-norm IPC-A-600 - Class 2, if applicable IPC-A-600 - Class 1, 2 or 3, if applicable
UL-approval of printed circuits (UL number, logo, date code) not possible UL94V0 possible
UL-approved base material yes, always possible
Insertion of date code possible, please mention in enquiry possible, please mention in enquiry
Insertion of supplier logo (LeitOn) possible, please mention in enquiry possible, please mention in enquiry
DIN EN ISO 9001 certification  yes yes
DIN EN ISO 9001 certification of printed circuit board production no possible
DIN EN ISO 14001 certification of printed circuit board production no possible
DIN EN ISO 16949 certification of printed circuit board production no possible

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