Minimum beding radius calculation for flexible printed circuits (FPC) - based on experience

The dropdown field suggests standard values for FPC's, but the values can be changed manually. Please note, that due to the assumption of a symmetric stack-up of the FPC only the top values are changeable. The supplied values are copied to the corresponding field at the bottom.

Min. bending radius calculation
Project name:
Presets:	Standard 1L-flex 35 µm Cu Standard 1L-flex 18 µm Cu Standard 2L-flex 28 µm Cu Standard 2L-flex 35 µm Cu
Cover lay	µm	Total Thickness	= µm
Adhesive	µm	Rmin (rule of thumb) Min. bending radius	= mm*
Copper	µm
Adhesive	µm
Polyimid base film	µm

Adhesive	µm
Copper	µm
Adhesive	µm
Cover lay	µm

* Due to the incorrect formula in IPC 2223, chapter 5.2.3.4.1 this calculation can only offer a rough hint for your estimation. LeitOn can not take any responsibility for the calculated value. The IPC organization has been informed about the mistake in their formula. As soon as there are corrections in the formula LeitOn will implement them.