Printed Circuit Boards | Situation | Market Situation | Price Pressure | Availability Pressure | PCB Market
Current Market Situation
The PCB market is currently under pricing and availability pressure like we haven't seen in years. Below, we inform you openly about the causes and how we will continue to ensure your supply.
What's Happening in the Market
Two trends are driving the market at the same time. On the one hand, the expansion of AI data centers worldwide is consuming raw materials that are also used in standard printed circuit boards, primarily copper and glass fabric. On the other hand, the aftermath of the war in Iran continues to cause shortages in the raw materials markets. In addition to oil, this has also led to shortages of sulfuric acid and resins. Furthermore, the price of copper is about 30 percent higher than it was a year ago and reached an all-time high in early 2026.
The mechanism that is often overlooked: The shortage begins with high-performance materials for AI hardware but is spilling over into the standard segment because both come from the same production lines. In the case of glass fabric, weaving mills are shifting their capacity to high-margin specialty glasses for high-speed layers, which is also causing a shortage of standard E-glass for FR4. The same is happening with copper foil: Manufacturers are prioritizing low-loss HVLP foil for high-speed applications, causing standard foil to fall behind.
Added to this are Chinese export quotas on E-glass and price increases across the entire product line. So demand is driven by the high end of the market, but the shortage ultimately affects everyone.
The special case of resin: In early April, the petrochemical complex in Jubail, Saudi Arabia, caught fire following a missile attack, bringing production to a halt. The missiles were intercepted, but falling debris set the complex ablaze. The operator, SABIC, supplies about 70 percent of the world’s high-purity PPE resin.
Important to note: This resin is primarily needed for true high-speed and low-loss laminates, such as those used in AI servers, 5G, and radar, and is rarely used in standard FR4. Unlike with glass and copper, there is no spillover effect onto the standard material here, because FR4 simply does not contain any PPE resin. The resin shortage therefore specifically affects high-frequency technology, while FR4 is primarily under pressure due to shortages of copper, glass, and epoxy resin in general.
What has changed in the market: As a result, the market has not only become more expensive, but in some respects also less flexible. Some base material manufacturers hardly accept orders for standard products with final thicknesses exceeding 1.2 mm and copper thicknesses exceeding 35 µm. Such laminates are usually not core layers and consume a disproportionate amount of material, which is why manufacturers are shifting their capacity toward the higher-margin core layer business. Materials such as 1080 prepreg and certain copper foils are also only available in limited quantities at times.
What This Means for Prices
What We Can Do Together Now
We can't plan ahead; we need actual orders for that. However, together we have several effective tools at our disposal.
When the Situation Eases
The two-part analysis: The two-part analysis described above is helpful here. The effects of the war are already subsiding: tensions in Iran are easing, oil prices are falling, and the resin shortage at SABIC is expected to ease starting in the first quarter of 2027.
The underlying trend: Structural pressure from the expansion of AI data centers, however, will persist as long as it ties up copper and glass fabric. Short-term bottlenecks will thus ease, but the underlying trend will not.
This assessment is based on our own supplier network, ongoing market monitoring, and external press sources.
Please feel free to contact us via kontakt@leiton.de. We’ll discuss your specific situation and find the right solution.