Downloads
Name | Type | Size | Download |
---|---|---|---|
Technology - Flexible Printed Circuits - Rev 240402(53,52 KB, PDF) | 54 KB | Download | |
Layer Stack-Ups - Flexible Circuit Boards - Rev 3.3(120,77 KB, PDF) | 121 KB | Download | |
Suggestions - Flexible Printed Circuits - Excess Length Design - Rev 1.3(171,51 KB, PDF) | 172 KB | Download | |
Baking of Flexible- and Rigid-flexible Printed Circuits before Assembly - Rev 1.3(185,74 KB, PDF) | 186 KB | Download |
Design rules
Options and Characteristics - Flexible Printed Circuits - Prototypes to Mass Production - FPCs | Online calculation/Standard | on explicit enquiry |
---|---|---|
Quantity | 1 piece to 1m² total area | from 1 piece to mass production |
Number of layers | 1 to 2 layers | up to 6 layers |
Material thickness | 65µm or 45µm respectively | 25µm to 0,30mm |
Copper thickness (base) | 18µm or 28~35µm* *2layer standard starting from 18µm base copper, plated up to ~28µm |
5µm, 9µm, 12µm, 18µm, 28~35µm* *2layer standard starting from 18µm base copper, plated up to ~28µm |
Material colour | beige/fawn | beige/fawn |
Base material | Polyimid with epoxy adhesive | adesive-less polyimide (PI), polyethylen (PET) |
Operating temperature | around 120° C | up to around 200° C (Tg 260), adesive-less polyimide (PI) |
Copper type | no selection | Elektrolytic deposit (ED) or rolled annealed (RA) |
Silk print layer | none, Top | none, top, bottom, double sided |
Solder mask colour | cover lay, yellow | green solder mask |
Cover lay | yellow polyimide | yellow, black or white polyimide |
Combination solder mask & cover lay | possible | possible |
Silk print colour | white | black, blue, yellow, white, red |
Via-Filling (no copper lid) | possible (with cover lay) | possible (with cover lay) |
Stiffener | for standard ZIF/LIF connector 0,30mm +/-0,05mm | several thicknesses, FR4 or polyimide |
3M-adhesive | possible | possible |
E-Test | possible | possible |
Plugging Plugging (with copper lid, e.g. for „via-in-pad“ technology) | not possible | not possible |
Peelable mask | not possible | possible (stiffeners) |
Chamfering/beveling | not possible | not possible |
Surface finish | immersion gold (ENIG) | immersion tin, immersion gold (ENIG), immersion silver, OSP |
Connector gold plating | not possible | possible |
Long term tempering | not possible | possible |
Maximum FPC size 1 and 2 layers | 230x580mm² | 230x580mm² |
Maximum FPC size 4 and 6 layers | not possible | 220x320mm² |
Lead time options 1- and 2 layers FPCs | 5WD, 7WD, 9WD, 12WD, 17WD, 22WD | from 3WD |
Lead time options 4- and 6 layers FPCs | not possible | from 10WD |
Routing | not possible | not possible |
V-Cut / scoring | not possible | possible, inside fixture/stiffener |
Jump scoring | not possible | not possible |
Punching (soft tooling) | standard | possible |
Punching (hard tooling) | not possible | possible |
Hand Cut | not possible | possible |
Hand cut & soft tooling combination | not possible | possible |
Counter sink drills / tapped holes | not possible | not possible |
Special multilayer stack-ups | not possible | possible |
Panel production - Flexible Printed Circuits - Prototypes to Mass Production - FPCs | Online calculation/Standard | on explicit enquiry |
---|---|---|
V-Cut / scoring panel | not possible | possible |
V-Cut - punching panel (combination) | not possible | possible |
Multi Panel (more than one 1 layout on a panel) | not possible | possible |
Panel setup (chosen by LeitOn) | possible | possible |
Panel setup (according to drawing) | not possible | possible |
PTH-drills (plated drills) - Flexible Printed Circuits - Prototypes to Mass Production - FPCs | Online calculation/Standard | on explicit enquiry |
---|---|---|
Smallest Drill 5µm to 18µm (final diameter) | not possible | 0,15mm |
Smallest Drill 28~35µm (final diameter) | 0,25mm | 0,15mm |
Smallest Drill 70µm (final diameter) | not possible | 0,20mm |
Smallest annular ring 5µm to 18µm | not possible | 0,10mm |
Smallest annular ring 28~35µm | 0,15mm | 0,10mm |
Smallest annular ring 70µm | not possible | 0,15mm |
Possible drill sizes | up to 5,5mm in 0,05mm steps | up to 5,5mm in 0,05mm steps |
drills >5,5mm | punched | punched |
Smallest hole-to-hole distance for 0,2mm to 2,0mm drill diameter (outer edge to outer edge) | 0,50mm | 0,40mm |
Smallest hole-to-hole distance for 2,05mm to 5,5mm drill diameter (outer edge to outer edge) | 0,60mm | 0,50mm |
Intersecting drills | not possible | replaced by punching |
Half open drills on PCB edge (Half open PTH) | not possible | possible |
NPTH-drills (non-plated drills) - Flexible Printed Circuits - Prototypes to Mass Production - FPCs | Online calculation/Standard | on explicit enquiry |
---|---|---|
Smallest drill size (final diameter) | 0,40mm | 0,30mm |
Possible drill sizes | 0,40mm to 5,5mm in 0,05mm steps | 0,30mm to 5,5mm in 0,05mm steps |
Copper clearance / distance to copper | 0,25mm | 0,20mm |
Drills >5,5mm | punched | punched |
Smallest distance from drill to outer edge | 0,60mm | 0,50mm |
Smallest hole-to-hole distance for 0,2mm to 2,0mm drill diameter (outer edge to outer edge) | 0,50mm | 0,40mm |
mallest hole-to-hole distance for 2,05mm to 5,5mm drill diameter (outer edge to outer edge) | 0,60mm | 0,50mm |
Intersecting drills | not possible | replaced by punching |
NPTH drills in copper area (without clearance) | not possible (copper will be cleared by min. 0,25mm) | on explicit notification |
Blind Vias - Flexible Printed Circuits - Prototypes to Mass Production - FPCs | Online calculation/Standard | on explicit enquiry |
---|---|---|
Smallest blind via (final diameter) | not possible | 0,20mm |
Smallest Aspect-Ratio | not possible | 1 |
Smallest annular ring | not possible | 0,15mm |
Buried Vias - Flexible Printed Circuits - Prototypes to Mass Production - FPCs | Online calculation/Standard | on explicit enquiry |
---|---|---|
Smallest buried via (final diameter) | not possible | 0,20mm |
Slots (non-plated) - Flexible Printed Circuits - Prototypes to Mass Production - FPCs | Online calculation/Standard | on explicit enquiry |
---|---|---|
Inner slots NPTH | by punching or hand cut | Hard tool punching |
Smallest inner slot NPTH | from 1,0mm up, punching or by hand cut | from 0,5mm up, hard tool punching |
Smallest radius (inner corners) NPTH | right angle | acute angle |
Slots (plated) - Flexible Printed Circuits - Prototypes to Mass Production - FPCs | Online calculation/Standard | on explicit enquiry |
---|---|---|
Inner slots PTH | not possible | possible |
Smallest inner slot PTH | not possible | from 0,5mm hard tool punching |
Edge plating (outer edge) | not possible | possible |
Special outline paths with plating (inner) | not possible | possible |
Smallest radius (inner corner, final) PTH | not possible | right angle |
Smallest annular ring | not possible | 0,15mm |
Copper Layers (outer) - Flexible Printed Circuits - Prototypes to Mass Production - FPCs | Online calculation/Standard | on explicit enquiry |
---|---|---|
Smallest trace 5µm | not possible | 0,03mm |
Smallest trace 9µm | not possible | 0,06mm |
Smallest trace 18µm | not possible | 0,09mm |
Smallest trace 28~35µm | 0,10mm oder 0,15mm | 0,10mm |
Smallest trace 70µm | not possible | 0,20mm |
Smallest trace-to-trace distance 18µm | not possible | 0,09mm |
Smallest trace-to-trace distance 28~35µm | 0,10mm oder 0,15mm | 0,10mm |
Smallest trace-to-trace distance 70µm | not possible | 0,20mm |
Smallest drill-pad diameter | 0,55mm | 0,40mm |
Smallest copper clearance to inner edges (slots) | 0,25mm | 0,20mm oder 0,0mm (plated) |
Smallest copper clearance to outer edges | 0,25mm | 0,20mm oder 0,0mm (metallisiert) |
Smallest copper clearance to outer edges (V-Cut) | not possible | 0,50mm |
Copper Layers (inner) - Multilayer Flexible Printed Circuits - Prototypes to Mass Production - FPCs | Online calculation/Standard | on explicit enquiry |
---|---|---|
Smallest trace 5 to 9µm | not possible | 0,04mm |
Smallest trace 18µm | not possible | 0,09mm |
Smallest trace 28~35µm | not possible | 0,10mm |
Smallest trace 70µm | not possible | 0,20mm |
Smallest trace-to-trace distance 5 to 9µm | not possible | 0,04mm |
Smallest trace-to-trace distance 18µm | not possible | 0,09mm |
Smallest trace-to-trace distance 28~35µm | not possible | 0,10mm |
Smallest trace-to-trace distance 70µm | not possible | 0,20mm |
Smallest drill-pad diameter | not possible | 0,40mm |
Smallest copper clearance to outer edges | not possible | 0,30mm |
Smallest copper clearance to inner edges (slots) | not possible | 0,35mm |
Smallest copper clearance to drills | not possible | 0,30mm |
Solder Mask - Flexible Printed Circuits - Prototypes to Mass Production - FPCs | Online calculation/Standard | on explicit enquiry |
---|---|---|
Smallest solder mask web (straight) | 0,10mm | 0,10mm |
Smallest solder mask web (round) | 0,08mm | 0,08mm |
Smallest size around copper pad | 0,05mm | <0mm |
Smallest text lines | 0,25mm | 0,25mm |
Cover Lay (punched / drilled / lasered) - Flexible Printed Circuits - Prototypes to Mass Production - FPCs | Online calculation/Standard | on explicit enquiry |
---|---|---|
Smallest rectangular pad (clearance) | 5x5mm | 2x2mm |
Smallest cover lay web (straight) | 5,0mm | 2,0mm |
Smallest cover lay web (round) | 3,0mm | 1,0mm |
Smallest size around copper pad | 0,2mm | <0mm |
Smallest text lines | not possible | not possible |
Silk Print - Flexible Printed Circuits - Prototypes to Mass Production - FPCs | Online calculation/Standard | on explicit enquiry |
---|---|---|
Smallest lines | 0,20mm | 0,15mm |
Smallest distance between lines | 0,20mm | 0,15mm |
Minimum clearance to copper pads | 0,20mm | 0,15mm |
Carbon Print - Flexible Printed Circuits - Prototypes to Mass Production - FPCs | Online calculation/Standard | on explicit enquiry |
---|---|---|
Smallest pad-to-pad distance | not possible | 0,50mm |
Tolerances, Values, Marks & Norms - Flexible Printed Circuits - Prototypes to Mass Production - FPCs | Online calculation/Standard | on explicit enquiry |
---|---|---|
Max. offset drill centre to centre of reference | 0,10mm | 0,075mm |
Max. offset solder stop (laquer or cover lay) / copper structures | 0,20mm | 0,10mm |
Finished drill sizes PTH (up to 3mm) | -0,05/+0,10mm | -0/+0,10mm |
Finished drill sizes PTH (> 3mm) | -0,05/+0,10mm | -0/+0,10mm |
Finished drill sizes NPTH (up to 6mm) | -0,05/+0,10mm | -0/+0,10mm |
Finished drill sizes NPTH (>6mm) | -0,05/+0,10mm | -0/+0,10mm |
Outline | +/-0,30mm | +/-0,10mm |
Max. offset outline/copper structures | +/-0,30mm | +/-0,10mm |
Scoring depth | not possible | +/-0,20mm |
Max. offset scoring/copper structures | not possible | +/-0,20mm |
Etch tolerance copper thickness 5µm | not possible | +0/-0,01mm |
Etch tolerance copper thickness 9µm | not possible | +0/-0,01mm |
Etch tolerance copper thickness 18µm | not possible | +0/-0,02mm |
Etch tolerance copper thickness 28~35µm | +0/-0,03mm | +0/-0,03mm |
Etch tolerance copper thickness 70µm | not possible | +0/-0,04mm |
Material thickness tolerance | +/-15% | differs, please enquire |
Copper thickness tolerance | +/-15% | +/-10% |
Thickness immersion tin | >= 0,5µm | >= 1,0µm |
Thickness tin (HAL-lead free) | not possible | nicht möglich |
Immersion gold for soldering purpose (nickel thickness) | 1,5µm to 3µm | 2,5µm to 5µm |
Immersion gold for soldering purpose (gold thickness) | 0,025µm to 0,075µm | 0,05µm to 0,075µm |
Immersion gold for gold-wire bonding (nickel thickness) | not possible | not possible |
Immersion gold for gold-wire bonding (gold thickness) | not possible | not possible |
Immersion gold for aluminium-wire bonding (nickel thickness) | 1,5µm to 3µm | 2,5µm to 5µm |
Immersion gold for aluminium-wire bonding (gold thichicht) | 0,025µm to 0,075µm | 0,05µm to 0,075µm |
Elctrolytic soft gold for connectors, soft, bonding (nickel thickness) | not possible | 4µm to 8µm |
Elctrolytic soft gold for connectors, soft, bonding (gold thickness) | not possible | 0,2µm to 0,3µm |
Elctrolytic hard gold for connectors, hard, no bonding (nickel thickness) | not possible | 4µm to 8µm |
Elctrolytic hard gold for connectors, hard, no bonding (gold thickness) | not possible | 0,8µm to 1µm |
Solder mask thickness | ca. 10µm | >15µm |
Cover lay thickness | 25,4µm | from 12,5µm |
Adhesive thickness Polyimid base material to copper (epoxy) | 25,4µm | from 12,5µm |
Adhesive thickness Polyimid-cover lay to copper | 25,4µm | from 12,5µm |
Copper thickness inside plated holes (PTH) 5µm to18µm | at least 6µm | at least 6µm |
Copper thickness inside plated holes (PTH) 28~35µm | at least 10µm | at least 10µm |
Copper thickness inside plated holes (PTH) 70µm | at least 12µm | at least 12µm |
Connector tolerance with siffener (total width) | +/-0,15mm | +/-0,075mm |
Connector tolerance with siffener (outline to pad) | +/-0,15mm | +/-0,075mm |
Chamfer angle | not possible | not possible |
Base material RoHS-compliant | yes alway | yes alway |
Surface finish RoHS-compliant | yes alway | yes alway |
IPC-norm | some | IPC-6013 - Class 1, 2 or 3 |
UL-certification of FPC (UL-number, Logo, datecode) | not possible | possible |
UL-certification of FPC base material | some | possible |
Insert date code (WW/YY) | possible, please advise in case of order/enquiry | possible, please advise in case of order/enquiry |
Insert supplier logo (LeitOn) | possible, please advise in case of order/enquiry | possible, please advise in case of order/enquiry |
DIN EN ISO 9001 certification for order preparation, CAM and order processing from LeitOn | yes | yes |
DIN EN ISO 9001 certification FPC supplier | yes | yes |
DIN EN ISO 14001 certification FPC supplier | no | possible |
DIN EN ISO 16949 certification FPC supplier | no | possible |
Climate-neutral operation
since 2021
since 2021
- CO2 neutral through compensation
- Circuit boards – green on the outside, also on the inside
Member of the Fachverband Elektronik-Design
- Expertise through active exchange
- Expertise through training and further education
ISO tested by the most renowned auditor in Germany
- ISO 9001:2015 Quality Management
- ISO 14001:2015 Environmental Management
UL approvals for various types of circuit boards
- UL for rigid FR4 PCBs
- UL for flexible circuit boards
- UL for aluminum IMS boards