Minimum bending radius calculation for flexible printed circuits (FPC) - based on experience

This tool helps you to calculate an estimated minimum bending radiuses of flexible printed circuits (FPCs). Please note that the formula from IPC 2223 is flawn. For this reason this estimation is given, entirely based on experience.

The dropdown field suggests standard values for FPC's, but the values can be changed manually. Please note, that due to the assumption of a symmetric stack-up of the FPC only the top values are changeable. The supplied values are copied to the corresponding field at the bottom.

Tool - FPC Bending Radius

Project name:

Presets:

Standard 1L-flex 35 µm Cu Standard 1L-flex 18 µm Cu Standard 2L-flex 28 µm Cu Standard 2L-flex 35 µm Cu

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Cover lay

µm

Adhesive

µm

Copper

µm

Adhesive

µm

Polyimid base film

µm

Adhesive

µm

Copper

µm

Adhesive

µm

Cover lay

µm

Total Thickness

= µ

Rmin (rule of thumb)Min. bending radius

= mm*

Print results

* Due to the incorrect formula in IPC 2223, chapter 5.2.3.4.1 this calculation can only offer a rough hint for your estimation. LeitOn can not take any responsibility for the calculated value. The IPC organization has been informed about the mistake in their formula. As soon as there are corrections in the formula LeitOn will implement them.