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Design Rules
Rogers-4000-HF Printed Circuits

Rogers 4000 HF Printed Circuits

Downloads

NameTypeSizeDownload
Datasheet - Rogers RO4003C and RO4350B - Rev 1.0(233,19 KB, PDF)PDF233 KB Download
Datasheet - PANASONIC_MEGTRON6-R-5775.pdf(189,91 KB, PDF)PDF190 KB Download
Technology - HF-Printed Circuits - Rev 2.0(93,96 KB, PDF)PDF94 KB Download
Standard Multilayer – Selected Impedances(568,41 KB, PDF)PDF568 KB Download

Options and Characteristics - Rigid Printed Circuits - PCBsOnline calculationon explicit enquiry
Quantity 1 piece up to 0,4m² total area from 1 piece
Layer quantity 1 to 2 layers up to 8 layers
Materialdicke RO4003C
(1- and 2 layers)
0,203mm; 0,508mm; 0,813mm; 1,524mm 0,203mm; 0,305mm; 0,406mm; 0,508mm; 0,813mm; 1,524mm
Materialdicke RO4350B
(1- und 2 layers)
0,168mm; 0,254mm; 0,508mm; 0,762mm; 1,524mm 0,168mm; 0,254mm; 0,338mm; 0,422mm; 0,508mm; 0,762mm; 1,524mm
Materialdicke Panasonic Megtron6
(1- und 2 layers)
0,25mm; 0,74mm; 1,46mm 0,15mm; 0,20mm; 0,30mm; 0,40mm; 0,50mm; 0,925mm
Material thickness (4, 6 and 8 layers) not possible with above mentioned cores up to 4,0mm
Copper thickness (1 and 2 layers) 35µm 35µm, 70µm
Copper thickness (4, 6 and 8 layers) not possible outer: 35µm, 70µm / inner: 18µm, 35µm
Material colour white white
Maximum operating temperature (Rogers) ca. 280° C ca. 280° C
Maximum operating temperature (Megtron6) ca. 170° C (TG 185° C) ca. 170° C (TG 185° C)
Minimum operating temperature ca. -40° C ca. -40° C
Silk print layer none, top, bottom, double sided none, top, bottom, double sided
Solder mask colour green, white, black, blue, red  green, white, black, blue, red and transparent (individual colours on exact colour value - RAL scale)
Silk print colour white black, blue, yellow, red
Via-Filling (no copper lid) possible possible
Electric test possible (flying probe) possible, also adapter
Plugging (with copper lid, e.g. for "via-in-pad technology" not possible possible
Peelable mask top, bottom or double sided top, bottom or double sided
Beveling not possible not possible
Surface finish HAL lead free, immersion tin, immersion gold (ENIG and ENEPIG) HAL lead free, immersion tin, immersion gold (ENIG and ENEPIG)
Finger gold not possible possible
Maximum printed circuit board size 1 and 2 layers PCB 430 x 275 mm² 580 x 420 mm²
Maximum printed circuit board size for multilayer PCBs not possible 430 x 275 mm²
Minimum singulated circuit board size 3cm², smaller can be calculated but will be panelized >1cm² <3cm² on enquiry
Minimum circuit board size in v-cut panels 5 x 5 mm²  5 x 5 mm²
Minimum circuit boar size in routing panels 10 x 10 mm², or 1cm²  10 x 10 mm², or 1cm²
Minimum printed circuit board width 5mm  5mm
Lead time options 1 and 2 layers printed circuits 12 hours, 2WD, 3WD, 5WD, 8WD In-day-service and over-night-service
Lead time options 4 to 8 layers multilayer printed circuits not possible Over-night-service
Routing always always, except punching
V-cut possible possible
Jump-v-cut possible possible
Punching not possible possible
Counter-sink-holes not possible possible
Z-axis milling not possible possible
Multilayer special stack-up not possible possible
Panel Production - Rigid Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
V-cut panel possible possible
V-Cut - Routing panel (combination) possible possible
Multi panels (more than one layout per panel) not possible possible
Panel setup (chosen by LeitOn) possible possible
Panel setup (according to drawing) possible possible
PTH-drills (plated drills) - Rigid Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Smallest drill 35µm (final diameter) 0,20mm, standard is 0,30mm 0,15mm
Smallest drill 70µm (final diameter) not possible 0,20mm
Smallest annular ring 35µm 0,15mm 0,10mm
Smallest annular ring 70µm not possible 0,12mm
Possibel drill diameters 0,20mm to 5,5mm in 0,05mm steps 0,15mm to 5,5mm in 0,05mm steps
Drills >5,5mm are routed are routed
Smallest drill distance 0,20mm to 2,00mm hole size (drill edge to drill edge) 0,40mm 0,30mm
Smallest drill distance 2,05mm to 5,50mm hole size (drill edge to drill edge) 0,50mm 0,40mm
Intersecting drills not possible, will be routed 1,0mm to 2,0mm
Half-open PTH on PCB edge not possible possible
NPTH-drills (non-plated drills) - Rigid Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Smalles drill size (final diameter) 0,60mm 0,30mm
Possible drill sizes 0,60mm to 5,5mm in 0,05mm steps 0,30mm to 5,5mm in 0,05mm steps
Copper clearance / distance to copper 0,20mm 0,20mm
Drills >5,5mm are routed are routed
Minimum drill-to-edge distance 0,50mm 0,50mm
Smallest drill distance 0,20mm to 2,00mm hole size (drill edge to drill edge) 0,40mm 0,20mm
Smallest drill distance 2,05mm to 5,5mm hole size (drill edge to drill edge) 0,50mm 0,50mm
Intersecting drills not possible, will be routed 1,0mm to 2,0mm
NPTH drills in copper area (without clearance) not possible (will be cleared from copper by min. 0,2mm) on explicit requirement only
Blind Vias - Rigid Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Smallest blind via (final diameter) not possible 0,30mm
Smallest Aspect-Ratio not possible 1
Smallest annular ring not possible 0,125mm
Buried Vias - Rigid Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Smallest buried via (final diameter) not possible 0,20mm
Routing (non-plated) - Rigid Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Inner routing NPTH possible possible
Smallest inner routing NPTH 0,70mm 0,70mm
Available routing diameters NPTH up to 2,0mm in 0,10mm steps up to 2,2mm in 0,10mm steps
Smallest radius (inner corners) NPTH 0,35mm 0,35mm
Routing (plated) - Rigid Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Inner routing PTH partly possible possible
Smallest inner routing PTH (final diameter) 0,60mm 0,60mm
Edge plating (outer edge) not possible possible
Special routing paths with plating (inner) partly possible possible
Available routing diameters PTH (final diameter) up to 1,9mm in 0,10mm steps up to 1,9mm in 0,10mm steps
Smallest radius (inner corner, final) PTH 0,30mm 0,30mm
Smallest annular ring 0,20mm 0,20mm
Copper Layers (outer) - Rigid Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Smallest trace 18µm not possible 0,07mm
Smallest trace 35µm 0,10mm; 0,125mm or 0,15mm 0,08mm
Smallest trace 70µm not possible 0,15mm
Smallest trace-to-trace distance 18µm not possible 0,07mm
Smallest trace-to-trace distance 35µm 0,10mm; 0,125mm or 0,15mm 0,08mm
Smallest trace-to-trace distance 70µm not possible 0,15mm
Smallest drill pad 0,50mm bei 0,20mm Bohrungen, Standard ist 0,60mm 0,38mm
Smallest copper clearance to inner routing 0,30mm 0,25mm or 0,0mm (plated)
Smallest copper clearance to board edge (routing) 0,30mm 0,25mm or 0,0mm (plated)
Smallest copper clearance to board edge (v-cut) 0,50mm 0,40mm
Copper Layers (inner) - Rogers-Multilayer Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Smallest trace 18µm not possible 0,09mm
Smallest trace 35µm not possible 0,10mm
Smallest trace 70µm not possible 0,15mm
Smallest trace-to-trace distance 18µm not possible 0,08mm
Smallest trace-to-trace distance 35µm not possible 0,08mm
Smallest trace-to-trace distance 70µm not possible 0,15mm
Smallest drill-pad diameter not possible 0,40mm
Smallest copper clearance to outer edges (routed) not possible 0,25mm
Smallest copper clearance to inner edges (routed) not possible 0,25mm
Smallest copper clearance to drills not possible 0,25mm
Solder Mask - Rigid Multilayer Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Smallest solder mask web (straight) 0,12mm 0,10mm
Smallest solder mask web (round) 0,075mm 0,05mm
smallest solder mask size around copper 0,075mm <0mm
Smallest text lines 0,25mm 0,20mm
Silk Print - Rigid Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Smallest lines 0,20mm 0,15mm
Smallest distance between lines 0,20mm 0,15mm
Minimum clearance to copper pads 0,20mm 0,15mm
Carbon Print - Rigid Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Smallest pad-to-pad distance not possible 0,50mm
Tolerances, Values, Marks & Norms - Rigid Printed Circuit Boards - PCBsOnline calculationon explicit enquiry
Max. offset drill centre to centre of reference 0,07mm 0,05mm
Max. offset solder mask / copper structures 0,12mm 0,075mm
Finished drill sizes PTH (0,55 to 3mm) +/-0,10mm +/-0,05mm
Finished drill sizes PTH (>3mm) +/-0,12mm +/-0,10mm
Finished drill sizes NPTH (up to 6mm) +/-0,10mm +/-0,05mm
Finished drill sizes NPTH (>6mm) +/-0,12mm +/-0,10mm
Outline +/-0,20mm +/-0,10mm
Max. offset outline/copper structures +/-0,15mm +/-0,10mm
V-cut depth +/-0,30mm +/-0,20mm
Z-axis milling not possible +/-0,05mm
V-Cut position to copper structures +/-0,25mm +/-0,15mm
Etch tolerance copper thickness 18µm not possible +0/-0,02mm
Etch tolerance copper thickness 35µm +0/-0,03mm +0/-0,03mm
Etch tolerance copper thickness 70µm not possible +0/-0,05mm
Material thickness tolerances <=1,0mm: +/-15%
>1,0mm: +/-10%
1,55mm: 1,6mm +/-10%
differs, please enquire
Copper thickness tolerances +20% / -15% +/-10%
Immersion tin thickness >=0,7µm >=1,0µm
HAL lead free thickness >= 8- bis 10µm, Kanten >0,5µm >= 8- bis 10µm, Kanten >0,5µm
HAL lead thickness not possible >= 8- bis 10µm, edges >0,5µm
ENIG - Immersion gold for soldering (nickel thickness) 2,5µm to 5µm 3µm to 6µm
ENIG - Immersion gold for soldering (gold thickness) 0,05µm to 0,075 µm 0,07µm to 0,12 µm
ENEPIG - Immersion nickel-palladium-gold for gold-wire bonding (nickel thickness) 4µm to 8µm 4µm to 8µm
ENEPIG - immersion nickel-palladium-gold for for gold-wire bonding (palladium thickness) 0,1µm to 0,3µm 0,1µm to 0,3µm
ENEPIG - imersion nickel-palladium-gold for gold-wire bonding (gold thickness) 0,02µm to 0,08µm 0,02µm to 0,08µm
Immersion gold for gold-wire bonding (nickel thickness) not possible 3µm to 6µm
Immersion gold for gold-wire bonding (gold thickness) not possible 0,4µm to 6µm
Immersion gold for aluminum-wire bonding (nickel thickness) 2,5µm to 5µm 3µm to 6µm
Immersion gold for aluminum-wire bonding (gold thickness) 0,05µm bis 0,075 µm 0,07µm bis 0,12 µm
Electrolytic connector gold - soft, bonding possible (nickel thickness) not possible 4µm to 8µm
Electrolytic connector gold - soft, bonding possible (gold thickness) not possible 0,3µm to 5µm
Electrolytic connector gold - hard, bonding NOT possible (nickel thickness) not possible 4µm to 8µm
Electrolytic connector gold - hard, bonding NOT possible (gold thickness) not possible 0,8µm to 5µm
Wet solder laquer thickness >15µm >15µm
Copper thickness in plated hole, traces 35µm minimum 18µm minimum 20µm
Copper thickness in plated hole, traces 70µm  not possible minimum 20µm
Winding max. 1% max. 0,5%
Warping max. 1% max. 0,5%
Beveling angle not possible not possible
Base materials RoHS-compliance yes, always yes, always
Surface finish RoHS-compiance yes, always always, unless "HAL lead" is explicitly required
IPC-norm IPC-A-600G - Class 2 IPC-A-600G - Class 1, 2 or 3
UL-approval of printed circuits (UL number, logo, date code) not possible not possible
UL-approved base material yes, always yes, always
Insertion of date code possible, please mention in enquiry possible, please mention in enquiry
Insertion of supplier logo (LeitOn) possible, please mention in enquiry possible, please mention in enquiry
DIN EN ISO 9001 certification of printed circuit board production yes yes
DIN EN ISO 14001 certification of printed circuit board production yes yes
DIN EN ISO 16949 certification of printed circuit board production no possible