Design Rules for Rogers-4000-HF Printed Circuits
Downloads
| Name | Type | Size | Download |
|---|---|---|---|
| Datasheet - Rogers RO4003C and RO4350B - Rev 1.0(233,19 KB, PDF) | 233 KB | Download View | |
| Datasheet - Rogers RO4360G2 - Rev 1.0(86,75 KB, PDF) | 87 KB | Download View | |
| Technology - HF-Printed Circuits(92,62 KB, PDF) | 93 KB | Download View |
Design rules
| Options and Characteristics - Rigid Printed Circuits - PCBs | Online calculation//Standard | on explicit enquiry |
|---|---|---|
| Quantity | 1 piece up to 0,4m² total area | from 1 piece |
| Layer quantity | 1 to 2 layers | up to 8 layers |
| Materialdicke RO4003C (1- and 2 layers) |
0,203mm, 0,3mm; 0,41mm; 0,51mm; 0,81mm; 1,524mm; | 0,203mm; 0,305mm; 0,406mm; 0,508mm; 0,813mm; 1,524mm |
| Materialdicke RO4350B (1- und 2 layers) |
0,168mm; 0,254mm; 0,508mm; 0,762mm; 1,524mm | 0,168mm; 0,254mm; 0,338mm; 0,422mm; 0,508mm; 0,762mm; 1,524mm |
| Materialdicke Panasonic Megtron6 (1- und 2 layers) |
0,25mm; 0,74mm; 1,46mm | 0,15mm; 0,20mm; 0,30mm; 0,40mm; 0,50mm; 0,925mm |
| Material thickness (4, 6 and 8 layers) | not possible | with above mentioned cores up to 4,0mm |
| Copper thickness (1 and 2 layers) | 35µm | 35µm, 70µm |
| Copper thickness (4, 6 and 8 layers) | not possible | outer: 35µm, 70µm / inner: 18µm, 35µm |
| Material colour | white | white |
| Maximum operating temperature (Rogers) | ca. 280° C | ca. 280° C |
| Maximum operating temperature (Megtron6) | ca. 170° C (TG 185° C) | ca. 170° C (TG 185° C) |
| Minimum operating temperature | ca. -40° C | ca. -40° C |
| Silk print layer | none, top, bottom, double sided | none, top, bottom, double sided |
| Solder mask colour | green, white, black, blue, red | green, white, black, blue, red and transparent (individual colours on exact colour value - RAL scale) |
| Silk print colour | white | black, blue, yellow, red |
| Via-Filling (no copper lid) | possible | possible |
| Electric test | possible (flying probe) | possible, also adapter |
| Plugging (with copper lid, e.g. for "via-in-pad technology" | not possible | possible |
| Peelable mask | not possible | top, bottom or double sided |
| Beveling | not possible | not possible |
| Surface finish | HAL lead free, immersion tin, immersion gold (ENIG and ENEPIG) | HAL lead free, immersion tin, immersion gold (ENIG and ENEPIG) |
| Finger gold | not possible | possible |
| Maximum printed circuit board size 1 and 2 layers PCB | 430 x 275 mm² | 580 x 420 mm² |
| Maximum printed circuit board size for multilayer PCBs | not possible | 430 x 275 mm² |
| Minimum singulated circuit board size | 3cm², smaller can be calculated but will be panelized | >1cm² <3cm² on enquiry |
| Minimum circuit board size in v-cut panels | 5 x 5 mm² | 5 x 5 mm² |
| Minimum circuit boar size in routing panels | 10 x 10 mm², or 1cm² | 10 x 10 mm², or 1cm² |
| Minimum printed circuit board width | 5mm | 5mm |
| Lead time options 1 and 2 layers printed circuits | 5WD, 7WD, 9WD, 12WD | 2WD |
| Lead time options 4 to 8 layers multilayer printed circuits | not possible | 10WD |
| Routing | always | always, except punching |
| V-cut | possible | possible |
| Jump-v-cut | possible | possible |
| Punching | not possible | possible |
| Counter-sink-holes | not possible | possible |
| Z-axis milling | not possible | possible |
| Multilayer special stack-up | not possible | possible |
| Panel Production - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| V-cut panel | possible | possible |
| V-Cut - Routing panel (combination) | possible | possible |
| Multi panels (more than one layout per panel) | possible | possible |
| Panel setup (chosen by Leiton) | possible | possible |
| Panel setup (according to drawing) | possible | possible |
| PTH-drills (plated drills) - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest drill 35µm (final diameter) | 0,20mm, standard is 0,30mm | 0,15mm |
| Smallest drill 70µm (final diameter) | not possible | 0,20mm |
| Smallest annular ring 35µm | 0,15mm | 0,10mm |
| Smallest annular ring 70µm | not possible | 0,12mm |
| Possibel drill diameters | 0,20mm to 5,5mm in 0,05mm steps | 0,15mm to 5,5mm in 0,05mm steps |
| Drills >5,5mm | are routed | are routed |
| Smallest drill distance 0,20mm to 2,00mm hole size (drill edge to drill edge) | 0,40mm | 0,30mm |
| Smallest drill distance 2,05mm to 5,50mm hole size (drill edge to drill edge) | 0,50mm | 0,40mm |
| Intersecting drills | not possible, will be routed | 1,0mm to 2,0mm |
| Half-open PTH on PCB edge | not possible | possible |
| NPTH-drills (non-plated drills) - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smalles drill size (final diameter) | 0,60mm | 0,30mm |
| Possible drill sizes | 0,60mm to 5,5mm in 0,05mm steps | 0,30mm to 5,5mm in 0,05mm steps |
| Copper clearance / distance to copper | 0,20mm | 0,20mm |
| Drills >5,5mm | are routed | are routed |
| Minimum drill-to-edge distance | 0,50mm | 0,50mm |
| Smallest drill distance 0,20mm to 2,00mm hole size (drill edge to drill edge) | 0,40mm | 0,20mm |
| Smallest drill distance 2,05mm to 5,5mm hole size (drill edge to drill edge) | 0,50mm | 0,50mm |
| Intersecting drills | not possible, will be routed | 1,0mm to 2,0mm |
| NPTH drills in copper area (without clearance) | not possible (will be cleared from copper by min. 0,2mm) | on explicit requirement only |
| Blind Vias - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest blind via (final diameter) | not possible | 0,30mm |
| Smallest Aspect-Ratio | not possible | 1 |
| Smallest annular ring | not possible | 0,125mm |
| Buried Vias - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest buried via (final diameter) | not possible | 0,20mm |
| Routing (non-plated) - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Inner routing NPTH | possible | possible |
| Smallest inner routing NPTH | 0,70mm | 0,70mm |
| Available routing diameters NPTH | up to 2,0mm in 0,10mm steps | up to 2,2mm in 0,10mm steps |
| Smallest radius (inner corners) NPTH | 0,35mm | 0,35mm |
| Routing (plated) - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Inner routing PTH | partly possible | possible |
| Smallest inner routing PTH (final diameter) | 0,60mm | 0,60mm |
| Edge plating (outer edge) | not possible | possible |
| Special routing paths with plating (inner) | partly possible | possible |
| Available routing diameters PTH (final diameter) | up to 1,9mm in 0,10mm steps | up to 1,9mm in 0,10mm steps |
| Smallest radius (inner corner, final) PTH | 0,30mm | 0,30mm |
| Smallest annular ring | 0,20mm | 0,20mm |
| Copper Layers (outer) - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest trace 18µm | not possible | 0,07mm |
| Smallest trace 35µm | 0,10mm; 0,125mm or 0,15mm | 0,08mm |
| Smallest trace 70µm | not possible | 0,15mm |
| Smallest trace-to-trace distance 18µm | not possible | 0,07mm |
| Smallest trace-to-trace distance 35µm | 0,10mm; 0,125mm or 0,15mm | 0,08mm |
| Smallest trace-to-trace distance 70µm | not possible | 0,15mm |
| Smallest drill pad | 0,50mm bei 0,20mm Bohrungen, Standard ist 0,60mm | 0,38mm |
| Smallest copper clearance to inner routing | 0,30mm | 0,25mm or 0,0mm (plated) |
| Smallest copper clearance to board edge (routing) | 0,30mm | 0,25mm or 0,0mm (plated) |
| Smallest copper clearance to board edge (v-cut) | 0,50mm | 0,40mm |
| Copper Layers (inner) - Rogers-Multilayer Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest trace 18µm | not possible | 0,09mm |
| Smallest trace 35µm | not possible | 0,10mm |
| Smallest trace 70µm | not possible | 0,15mm |
| Smallest trace-to-trace distance 18µm | not possible | 0,08mm |
| Smallest trace-to-trace distance 35µm | not possible | 0,08mm |
| Smallest trace-to-trace distance 70µm | not possible | 0,15mm |
| Smallest drill-pad diameter | not possible | 0,40mm |
| Smallest copper clearance to outer edges (routed) | not possible | 0,25mm |
| Smallest copper clearance to inner edges (routed) | not possible | 0,25mm |
| Smallest copper clearance to drills | not possible | 0,25mm |
| Solder Mask - Rigid Multilayer Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
 Smallest solder mask web (straight) |
0,12mm | 0,10mm |
 Smallest solder mask web (round) |
0,075mm | 0,05mm |
 smallest solder mask size around copper |
0,075mm | <0mm |
| Smallest text lines | 0,25mm | 0,20mm |
| Silk Print - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest lines | 0,20mm | 0,15mm |
| Smallest distance between lines | 0,20mm | 0,15mm |
| Minimum clearance to copper pads | 0,20mm | 0,15mm |
| Carbon Print - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Smallest pad-to-pad distance | not possible | 0,50mm |
| Tolerances, Values, Marks & Norms - Rigid Printed Circuit Boards - PCBs | Online calculation/Standard | on explicit enquiry |
|---|---|---|
| Max. offset drill centre to centre of reference | 0,07mm | 0,05mm |
| Max. offset solder mask / copper structures | 0,12mm | 0,075mm |
| Finished drill sizes PTH (0,55 to 3mm) | +/-0,10mm | +/-0,05mm |
| Finished drill sizes PTH (>3mm) | +/-0,12mm | +/-0,10mm |
| Finished drill sizes NPTH (up to 6mm) | +/-0,10mm | +/-0,05mm |
| Finished drill sizes NPTH (>6mm) | +/-0,12mm | +/-0,10mm |
| Outline | +/-0,20mm | +/-0,10mm |
| Max. offset outline/copper structures | +/-0,15mm | +/-0,10mm |
| V-cut depth | +/-0,30mm | +/-0,20mm |
| Z-axis milling | not possible | +/-0,05mm |
| V-Cut position to copper structures | +/-0,25mm | +/-0,15mm |
| Etch tolerance copper thickness 18µm | not possible | +0/-0,02mm |
| Etch tolerance copper thickness 35µm | +0/-0,03mm | +0/-0,03mm |
| Etch tolerance copper thickness 70µm | not possible | +0/-0,05mm |
| Material thickness tolerances | <=1,0mm: +/-15% >1,0mm: +/-10% 1,55mm: 1,6mm +/-10% |
differs, please enquire |
| Copper thickness tolerances | +20% / -15% | +/-10% |
| Immersion tin thickness | >=0,7µm | >=1,0µm |
| HAL lead free thickness | >= 8- bis 10µm, Kanten >0,5µm | >= 8- bis 10µm, Kanten >0,5µm |
| HAL lead thickness | not possible | >= 8- bis 10µm, edges >0,5µm |
| ENIG - Immersion gold for soldering (nickel thickness) | 2,5µm to 5µm | 3µm to 6µm |
| ENIG - Immersion gold for soldering (gold thickness) | 0,05µm to 0,075 µm | 0,07µm to 0,12 µm |
| ENEPIG - Immersion nickel-palladium-gold for gold-wire bonding (nickel thickness) | 4µm to 8µm | 4µm to 8µm |
| ENEPIG - immersion nickel-palladium-gold for for gold-wire bonding (palladium thickness) | 0,1µm to 0,3µm | 0,1µm to 0,3µm |
| ENEPIG - imersion nickel-palladium-gold for gold-wire bonding (gold thickness) | 0,02µm to 0,08µm | 0,02µm to 0,08µm |
| Immersion gold for gold-wire bonding (nickel thickness) | not possible | 3µm to 6µm |
| Immersion gold for gold-wire bonding (gold thickness) | not possible | 0,4µm to 6µm |
| Immersion gold for aluminum-wire bonding (nickel thickness) | 2,5µm to 5µm | 3µm to 6µm |
| Immersion gold for aluminum-wire bonding (gold thickness) | 0,05µm bis 0,075 µm | 0,07µm bis 0,12 µm |
| Electrolytic connector gold - soft, bonding possible (nickel thickness) | not possible | 4µm to 8µm |
| Electrolytic connector gold - soft, bonding possible (gold thickness) | not possible | 0,3µm to 5µm |
| Electrolytic connector gold - hard, bonding NOT possible (nickel thickness) | not possible | 4µm to 8µm |
| Electrolytic connector gold - hard, bonding NOT possible (gold thickness) | not possible | 0,8µm to 5µm |
| Wet solder laquer thickness | >15µm | >15µm |
| Copper thickness in plated hole, traces 35µm | minimum 18µm | minimum 20µm |
| Copper thickness in plated hole, traces 70µm | not possible | minimum 20µm |
| Winding | max. 1% | max. 0,5% |
| Warping | max. 1% | max. 0,5% |
| Beveling angle | not possible | not possible |
| Base materials RoHS-compliance | yes, always | yes, always |
| Surface finish RoHS-compiance | yes, always | always, unless "HAL lead" is explicitly required |
| IPC-norm | IPC-A-600 - Class 2 | IPC-A-600 - Class 1, 2 or 3 |
| UL-approval of printed circuits (UL number, logo, date code) | not possible | not possible |
| UL-approved base material | yes, always | yes, always |
| Insertion of date code | possible, please mention in enquiry | possible, please mention in enquiry |
| Insertion of supplier logo (Leiton) | possible, please mention in enquiry | possible, please mention in enquiry |
| DIN EN ISO 9001 certification of printed circuit board production | yes | yes |
| DIN EN ISO 14001 certification of printed circuit board production | yes | yes |
| DIN EN ISO 16949 certification of printed circuit board production | no | possible |
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