Additional information for extra options:

Type-3/4 plugging:

This option will plug your vias with an additional paste. Whether this plugging will be type 3 or 4 depends on the layout files and the chosen production parameters. You can read further information about the plugging and filling types here (Download ). The exact plugging type will be mentioned in your order confirmation once CAM preparation is finished. You may also send us your files in advance and we will tell you the exact filling type.

Requirements:

• Please notify us if you are using plated holes <0,5mm for components (THT) in your layout. The diameters below 0,5mm are usually treated as sole VIAs and therefore handled differently in CAM and production.
• Vias are included within a normal range. Extremely high drill quantities (e.g. heat sinks/thermal vias) may require additional charges and lead times.

Explanations of the delivery types:

as single PCB
You will receive single routed PCBs. Small PCBs (both sides <20mm or total area <300mm²) will be delivered in a routing panel. This panel may contain 2mm web routings and a 6mm panel frame on all sides. In case you prefer a single PCB with a panel frame, please select "custom panel".

as LeitOn-Panel
You type in the size of the single PCB at X/Y and the total quantity. LeitOn will put the PCBs in a suitable production panel, using routing, scoring (v-cut) or a combination of both. The panel will be designed by LeitOn and come with 6 mm surrounding panel boarder and fiducials. The size of a LeitOn-panel is around 160 x 100 mm². This delivery type is especially useful for small PCBs. If you have special panel requirements please select “Customer Panel”.

as Custom Panel
We design the panel according to your requirements (descriptions, drawings or Gerber files). Please fill in the total panel size in "size of panel" and the step & repeat inside the panel "step & repeat". E.g. if you fill in a step & repeat „2x5“ (10up-panel) the total quantity has to be 10, 20, 30 or another multiplier of 10.

Requirements: 2mm-routing between the PCBs is possible (the PCBs itself are allowed to contain smaller routings.), or v-cut. The PCB must contain identical PCBs. Multi-panels are not included in this option (see above).

Blind vias are drilled from the outer layer to a specific inner layer. The price is valid for each blind via program. In each program there can be several different diameters.

Example:

1. Drill program: Top to inner layer 1
2. Drill program: Top to inner layer 2
3. Drill program: Bottom to inner layer 2
4. and so on...

In the Online calculation you can maximum calculate 2 blind via programs. If your PCB design needs more than that, please send an enquiry by email.

• The smallest blind via pad in your layout can be 0,50 mm. The drill diameter will then be 0,30 mm
• smallest aspect ratio: 1:1
• maximum drill depth is: layout drill diameter + drill surplus (0,1mm)
• Example: 0,5mm blind via can be drilled 0,6mm deep.

Connector gold requires a connection of the pads via traces, called "plating bus". This bus provides the electrical connection to the pads so that we are able to plate electrolytic gold. For this reason, only pads that are lying on the outside of the PCB layout can be plated with connector gold. Usually this means “connectors”. The bus traces will later be cut in the routing process so that there is no electric relevance to them.

However, depending on the distance of the pads to the outline and the desired bevelling angle, remains of the plating bus traces may be visible next to the pads. Plating pads that are further inside the layout can only be done in exceptional cases, requires additional work and therefore must be enquired separately by email. We do recommend bevelling for any connector. The bevelling option can be found further down in the calculation.

• The biggest possible buried via is 0,30mm, minimum 0,20mm. Buried vias will be adjusted to this range by us. If you explicitly require bigger buried vias, please send us your enquiry.
• No stacked-vias (blind vias into buried vias). This requires additional plugging processes. Please enquire separately.
• Stack-up may differ from the standards in our download-section.

Bevelling is especially useful for connectors and if you have selected “connector gold” as an option.

Standard bevelling is performed with a 45° angle from both sides. Single-sided bevelling or a 60° angle are also possible. The depth can be different from each side. Please describe your required bevelling characteristics (sides, angle, depth) in the comments or attach a drawing. It is useful to include a second outline layer inside the layout files which indicates the position of the bevelling.

Surrounding/complete outline bevelling is not included in this price. For such PCBs please enquire by email.

Please read our extensive documentation about semi-flex PCBs here

The most important information in brief:

• Semiflex is suitable for flex-to-Install-applications (not for dynamic bending).
• Maximum one outer copper layer is allowed in the semi-flexible area, no inner layers.
• Maximum copper thickness is 70µm.
• Semi-flexible areas for online orders are milled to a remaining thickness of 200µm +/-50µm. Due to this thinning this area will be "flexible".
• As rule of thumb you can bend the PCB 45° per 5mm length.
• Bending is only allowed into the direction of the milling side. If possible, use heat (e.g. a hair-dryer) and a stable object to bend the PCB evenly. Do not apply any pulling-force.
• Only green flex-solder mask is available for semi-flexible PCBs.
• Semi-flexible circuits must be calculated and produced in panel format. The panel-frame protects the boards during transportation and assembly. This is also required for single boards. If you like us to prepare the panel for you, please select "LeitOn panel".
• More than three semi-flex areas, different milling depths or other options on enquiry.

Impedance measurements are only availbalbe together with an impedance calculation by LeitOn. This calculation is necessary in ordert o fine-tune internal production parameters.

In case you have an impedance controlled layout that has been calculated by yourself, an impedance measurement from LeitOn still requires a calculation on our side.

If you do not want to order this additional impedance calculation, then please select “no impedances” and order it without measurement. We will then take no responsibility for the impedances even if the selected stack-up matches your calculations.

By the way: you can order the impedance calculation prior to the PCB production separately. You can then later order the PCB and select "Impednce measurement (calculation done by LeitOn already)".

The target impedance is reached within a tolerance of +/-10%.

Simply milling through any PTH would severely damage the copper wall, tear it from the PCB and leave burr. Therefore, LeitOn offers a smart process for producing such half-open plated through holes.

Please bear on mind the following requirements:

• Smallest drilling diameter (for HOPTH, others may be smaller): 0,5mm (in your file)
• Distance to next trace/pad 200µm (200µm distance between HOPTH annular ring to adjacent trace/pad)
• For multilayers: NO connection to inner layers exclusively over HOPTH.

570 x 500 mm² sized Printed Circuits are available with the following exceptions:

• from 1mm base material thickness up
• only solder mask green and white
• no TG250°C
• TG170°C only 1,55mm thickness 35/35 copper

For urgent orders which require special base material thickness and copper thickness combinations, please contact us prior to placing an order so we can check the stock. Thank you!

"Individual Production" means that your PCBs are produced exclusively on one production panel. Therefore, higher costs apply, minimum order values may occur and express surcharges are higher.

However, you have the full range of technology available. We recommend to double-check if the selected "Individual Production" technology is really necessary. By selecting a "Shared Production" option instead, prices may decline drastically.

"Shared Production" stands for splitting costs over several PCB orders that are combined on one production panel.

Apart from shared costs no minimum order values (MOQ) apply and faster express surcharges are much lower. In return, some options are not available.

"Shared Production" stands for splitting costs over several PCB orders that are combined on one production panel.

Apart from shared costs no minimum order values (MOQ) apply and faster express surcharges are much lower. In return, some options are not available.

"Individual Production" means that your PCBs are produced exclusively on one production panel. Therefore, higher costs apply, minimum order values may occur and express surcharges are higher.

However, you have the full range of technology available. We recommend to double-check if the selected "Individual Production" technology is really necessary. By selecting a "Shared Production" option instead, prices may decline drastically.

You already calculated your quotation or received one from LeitOn?
Then type in the quotation number here!