Technology and design rules
for rigid flexible printed circuits

Downloads
Name | Type | Size | Download |
---|---|---|---|
Stackup SF A1 2-layer - Standard online calculation(47,61 KB, PDF) | 48 KB | Download | |
Stackup SF A1 4-layer - Standard online calculation(48,27 KB, PDF) | 48 KB | Download | |
Stackup SF A1 6-layer - Standard online calculation(49,18 KB, PDF) | 49 KB | Download |
Options and characteristics - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
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Quantities | 1 piece to max. 0,4m² total area | 1 piece to mass prodcuction |
Layer count (total) | 2-, 4- and 6-layers | up to 12 layers |
Layer count (flexible) | 2-, 4- und 6-Lagen | up to 4 layer |
Flex layer position | outer | outer and inner |
Material thickness | 1,2 / 1,6 / 2,0mm | 0,5 bis 3,2mm |
Kupferdicke (Basis) | 35µm | 35 / 70µm |
Material color | beige / red-brown (oolyimide) | beige / red-brown (polyimide) |
Base material type | FR4 with oolyimide and epoxy adhesive | FR4 with polyimide and epoxy adhesive |
Maximum operating temeprature | ca. 120° C | ca. 120° C |
Copper type | no selection | ED- or RA-copper |
Silk print layers | none, top, bottom, double-sided | none, top, bottom, double-sided |
Solder mask colors | green | yellow, green, white, red, blue, black |
Cover-lay | yellow polyimide |
yellow, black or white polyimide |
Combination of cover-lay and solder mask | possible | possible |
Sil print color | white | white, black, blue, yellow, green, red |
Via-filler (no copper-lid) | possible by cover-lay | possible by cover-lay |
Stiffener | possible | variety of thicknesses, FR4 or polyimide, standard ZIF/LIF connectors 0,30mm +/-0,05mm |
3M-adhesive | not possible | possible |
Electrical test | possible | not possible |
Plugging (with copper-lid, e.g. for "via-in-pad") | not possible | possible with inner-flex-layers |
Peelable mask | not possible | possible |
Beveling | not possible | possible (rigid area) |
Surface finish | immersion gold ENIG | immersion gold ENIG or ENEPIG |
Connector gold | not possible | possible |
Long term baking | not possible | possible |
Maximum PCB size 2-layer | 235x370mm² | depends on specifications, please enquire |
Maximum PCB size 4- and 6-layer | 235x370mm² | depends on specifications, please enquire |
Lead time options 2-layer | 10WD, 15WD, 20WD | <10WD |
Lead time options 4- and 6-layer | 10WD, 15WD, 20WD | <10WD |
Routing | included | included |
V-cut | not possible | possible, in rigid area |
Jump v-cut | not possible | possible, in rigid area |
Punching | not possible | not possible |
Counter-sink drills | not possible | possible |
Special multilayer stack-ups | not possible | possible |
Panelization - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
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V-cut-panel | not possible | possible |
V-cut-punching-panel | not possible | not possible |
Multy-panel (more than 1 layout) | not possible | possible |
Panelization (chosen by LeitOn) | possible | possible |
Panelization (according to drawing, prepared by LeitOn) | possible | possible |
PTH-Drills (plated) - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
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Smallest drill | 0,30mm | 0,20mm |
Smallest annular ring | 0,15mm | 0,10mm |
Drill sizes | up to 5,5mm in 0,05mm steps | up to 5,5mm in 0,05mm steps |
Drills >5,5mm | routing | routing |
Min. hole distance 0,2mm to 2,0mm drill diameter | 0,50mm | 0,40mm |
Min. hole distance 2,05mm to 5,5mm drill diameter | 0,60mm | 0,50mm |
Min. distance PTH-drill to flexible layer | 1,00mm | 0,80mm |
Intersecting drills | not possible | not possible |
Half-open PTH | not possible | not possible |
PTH in flexible area | not possible | possible |
NPTH-Drills (non-plated) - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
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Smallest drill | 0,30mm | 0,20mm |
Drill sizes | 0,30mm to 5,5mm in 0,05mm steps | 0,20mm to 5,5mm in 0,05mm steps |
Distance to copper areas | 0,25mm | 0,20mm |
Drills >5,5mm | routing | routing |
Min. distance to outline | 0,60mm | 0,50mm |
Min. hole distance 0,2mm to 2,0mm drill diameter | 0,50mm | 0,40mm |
Min. hole distance 2,05mm to 5,5mm drill diameter | 0,60mm | 0,50mm |
Intersecting drills | not possible | nicht möglich |
NPTH in copper areas | not possible(0,2mm clearance will be applied) | on explicit enquiry |
Blind vias - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
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Smallest blind via (final) | not possible | 0,10mm |
Smallest aspect-ratio | not possible | 1:1 |
Smallest annular ring | not possible | 0,15mm |
Buried vias - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
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Smallest buried via | not possible | 0,10mm |
Slots (non-plated) - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
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Inner routing / slots (NPTH) | possible | possible |
Smallest routing / slots (NPTH) | from 1,0mm up | from 0,6mm up |
Smallest routing radious (NPTH) | 0,5mm | 0,3mm |
Slots (plated) - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
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Plated slots (PTH) | not possible | possible |
Smallest plated slot | not possible | from 0,7mm |
Plated outline | not possible | not possible |
Special slot shapes, plated (inner) | not possible | possible |
Smallest radius, plated | not possible | 0,3mm |
Smallest annular ring | not possible | 0,15mm |
Copper layers (outer) - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
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Smallest trace width 35µm | 0,15mm | 0,10mm |
Smallest trace width 70µm | not possible | 0,20mm |
Smallest trace distance 35µm | 0,15mm | 0,10mm |
Smallest trace distance 70µm | not possible | 0,20mm |
Smallest drill-pad | 0,60mm | 0,50mm |
Smallest clearance to inner slots | 0,25mm | 0,20mm or 0,0mm (plated) |
Smallest clearance to outline | 0,25mm | 0,20mm or 0,0mm (plated) |
Copper layers (outer) - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
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Smallest trace width 35µm | not possible | 0,10mm |
Smallest trace width 70µm | not possible | 0,20mm |
Smallest trace distance 35µm | not possible | 0,10mm |
Smallest trace distance 70µm | not possible | 0,20mm |
Smallest drill-pad | not possible | 0,40mm |
Smallest clearance to inner outline | not possible | 0,30mm |
Smallest clearance to inner slots | not possible | 0,35mm |
Smallest clearance to inner drills | not possible | 0,30mm |
Solder mask - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
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0,10mm | 0,08mm |
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0,05mm | 0,05mm |
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0,05mm | <0mm |
Smallest text size | 0,25mm | 0,25mm |
Cover-lay (punched / drilled / lasered) - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
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Smallest rectangular pad | 5x5mm | 2x2mm |
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5,0mm | 2,0mm |
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3,0mm | 1,0mm |
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0,2mm | <0mm |
Smallest text size | not possible | not possible |
Silk print - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
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Smallest text size | 0,20mm | 0,15mm |
Smallest text distance | 0,20mm | 0,15mm |
Minimum clearance to pads | 0,20mm | 0,15mm |
Carbon print - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
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Minimum pad distance | not possible | 0,50mm |
Tolerances, values, markings & standards - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
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Max. deviation between centre of drill and target | 0,10mm | 0,075mm |
Max. offset solder mask to copper | 0,20mm | 0,10mm |
Drill diameter PTH (<=3mm) | -0,05/+0,10mm | -0/+0,10mm |
Drill diameter PTH (>3mm) | -0,05/+0,10mm | -0/+0,10mm |
Drill diameter NPTH (<=6mm) | -0,05/+0,10mm | -0/+0,10mm |
Drill diameter NPTH (>6mm) | -0,05/+0,10mm | -0/+0,10mm |
Outline | +/-0,30mm | +/-0,10mm |
Max. offset copper to outinline | +/-0,30mm | +/-0,10mm |
V-cut depth | not possible | +/-0,20mm |
Max. offset v-cut to copper | not possible | +/-0,20mm |
Etching tolerance (trace width) 35µm | +0/-0,03mm | +0/-0,03mm |
Etching tolerance (trace width) 70µm | not possible | +0/-0,04mm |
Material thickness tolerance | +/-15% | varies, please enquire |
Copper thickness tolerance | +/-15% | +/-10% |
Immersion tin thickness | not possible | not possible |
HAL lead-free thickness | not possible | not possible |
Immersion gold, ENIG (nickel thickness) | 2,5µm to 5µm | 2,5µm to 5µm |
Immersion gold, ENIG (gold thickness) | 0,025µm to 0,075µm | 0,05µm to 0,075µm |
Immersion gold, ENEPIG (nickel thickness) | not possible | 2,5µm to 5µm |
Immersion gold, ENEPIG (gold thickness) | not possible | 0,025µm to 0,05µm |
Elect. gold - soft, bonding (nickel thickness) | not possible | not possible |
Elect. gold - soft, bonding (gold thickness) | not possible | not possible |
Elect. connector gold - hard, no bonding (nickel thickness) | not possible | 4µm to 8µm |
Elect. connector gold - hard, no bonding (gold thickness) | not possible | 0,8µm to 1,2µm |
Solder mask thickness | ca. 10µm | >15µm |
Cover-lay thickness | 25,4µm | ab 12,5µm |
Thickness of adhesive polyimide-basefilm to copper (epoxy) | 25,4µm | ab 12,5µm |
Thickness of adhesive polyimide-cover-lay to copper (epoxy) | 25,4µm | ab 12,5µm |
Copper wall 35µm | min. 18µm | min. 20µm |
Copper wall 70µm | not possible | min. 20µm |
Connector tolerance with stiffener (total width) | not possible | +/-0,10mm |
Connector tolerance with stiffener (pad to outline) | not possible | +/-0,10mm |
Beveling angle | not possible | 45° / 60° |
Base material RoHS-complian | yes, always | yes, always |
Surface finish RoHS-complian | yes, always | yes, always |
IPC-standard | class 2 | IPC-6013 - class 1, 2 or 3 |
UL-approval of RFPCB (UL-number, logo, date code) | not possible | not possible |
UL-approval of base materials | possible | possible |
Adding date code (WW/YY) | possible, please mention in comments | possible, please mention in comments |
Adding company logo (LeitOn) | possible, please mention in comments | possible, please mention in comments |
DIN EN ISO 9001 certification of LeitOn GmbH | yes | yes |
DIN EN ISO 14001 certification of LeitOn GmbH | no | possible |
DIN EN ISO 16949 certification | no | possible |