Technology and design rules
for rigid flexible printed circuits

Technology and design rulesfor rigid flexible printed circuits

Downloads

NameTypeSizeDownload
Stackup SF A1 2-layer - Standard online calculation(47,61 KB, PDF)PDF48 KB Download
Stackup SF A1 4-layer - Standard online calculation(48,27 KB, PDF)PDF48 KB Download
Stackup SF A1 6-layer - Standard online calculation(49,18 KB, PDF)PDF49 KB Download
Other stack-ups available on enquiry!
Options and characteristics - rigid-flexible printed circuitsOnline calculationOn explicit enquiry
Quantities 1 piece to max. 0,4m² total area 1 piece to mass prodcuction
Layer count (total) 2-, 4- and 6-layers up to 12 layers
Layer count (flexible) 2-, 4- und 6-Lagen up to 4 layer
Flex layer position outer outer and inner
Material thickness 1,2 / 1,6 / 2,0mm 0,5 bis 3,2mm
Kupferdicke (Basis) 35µm 35 / 70µm
Material color beige / red-brown (oolyimide) beige / red-brown (polyimide)
Base material type FR4 with oolyimide and epoxy adhesive FR4 with polyimide and epoxy adhesive
Maximum operating temeprature ca. 120° C ca. 120° C
Copper type no selection ED- or RA-copper
Silk print layers none, top, bottom, double-sided none, top, bottom, double-sided
Solder mask colors green yellow, green, white, red, blue, black
Cover-lay yellow polyimide

yellow, black or white polyimide

Combination of cover-lay and solder mask possible possible
Sil print color white white, black, blue, yellow, green, red
Via-filler (no copper-lid) possible by cover-lay possible by cover-lay
Stiffener possible variety of thicknesses, FR4 or polyimide, standard ZIF/LIF connectors 0,30mm +/-0,05mm
3M-adhesive not possible possible
Electrical test possible not possible
Plugging (with copper-lid, e.g. for "via-in-pad") not possible possible with inner-flex-layers
Peelable mask not possible possible
Beveling not possible possible (rigid area)
Surface finish immersion gold ENIG immersion gold ENIG or ENEPIG
Connector gold not possible possible
Long term baking not possible possible
Maximum PCB size 2-layer 235x370mm² depends on specifications, please enquire
Maximum PCB size 4- and 6-layer 235x370mm² depends on specifications, please enquire
Lead time options 2-layer 10WD, 15WD, 20WD <10WD
Lead time options 4- and 6-layer 10WD, 15WD, 20WD <10WD
Routing included included
V-cut not possible possible, in rigid area
Jump v-cut not possible possiblein rigid area
Punching not possible not possible
Counter-sink drills not possible possible
Special multilayer stack-ups not possible possible
Panelization - rigid-flexible printed circuitsOnline calculationOn explicit enquiry
V-cut-panel not possible possible
V-cut-punching-panel not possible not possible
Multy-panel (more than 1 layout) not possible possible
Panelization (chosen by LeitOn) possible possible
Panelization (according to drawing, prepared by LeitOn) possible possible
PTH-Drills (plated) - rigid-flexible printed circuitsOnline calculationOn explicit enquiry
Smallest drill 0,30mm 0,20mm
Smallest annular ring 0,15mm 0,10mm
Drill sizes up to 5,5mm in 0,05mm steps up to 5,5mm in 0,05mm steps
Drills >5,5mm routing routing
Min. hole distance 0,2mm to 2,0mm drill diameter  0,50mm 0,40mm
Min. hole distance 2,05mm to 5,5mm drill diameter  0,60mm 0,50mm
Min. distance PTH-drill to flexible layer 1,00mm 0,80mm
Intersecting drills not possible not possible
Half-open PTH not possible not possible
PTH in flexible area not possible possible
NPTH-Drills (non-plated) - rigid-flexible printed circuitsOnline calculationOn explicit enquiry
Smallest drill  0,30mm 0,20mm
Drill sizes 0,30mm to 5,5mm in 0,05mm steps 0,20mm to 5,5mm in 0,05mm steps
Distance to copper areas 0,25mm 0,20mm
Drills >5,5mm routing routing
Min. distance to outline 0,60mm 0,50mm
Min. hole distance 0,2mm to 2,0mm drill diameter  0,50mm 0,40mm
Min. hole distance 2,05mm to 5,5mm drill diameter  0,60mm 0,50mm
Intersecting drills not possible nicht möglich
NPTH in copper areas not possible(0,2mm clearance will be applied) on explicit enquiry
Blind vias rigid-flexible printed circuitsOnline calculationOn explicit enquiry
Smallest blind via (final) not possible 0,10mm
Smallest aspect-ratio not possible 1:1
Smallest annular ring not possible 0,15mm
Buried vias - rigid-flexible printed circuitsOnline calculationOn explicit enquiry
Smallest buried via not possible 0,10mm
Slots (non-plated) - rigid-flexible printed circuitsOnline calculationOn explicit enquiry
Inner routing / slots (NPTH) possible possible
Smallest routing / slots (NPTH) from 1,0mm up from 0,6mm up
Smallest routing radious (NPTH) 0,5mm 0,3mm
Slots (plated) - rigid-flexible printed circuitsOnline calculationOn explicit enquiry
Plated slots (PTH) not possible possible
Smallest plated slot not possible from 0,7mm 
Plated outline  not possible not possible
Special slot shapes, plated (inner) not possible possible
Smallest radius, plated not possible 0,3mm
Smallest annular ring not possible 0,15mm
Copper layers (outer) - rigid-flexible printed circuitsOnline calculationOn explicit enquiry
Smallest trace width 35µm 0,15mm 0,10mm
Smallest trace width 70µm not possible 0,20mm
Smallest trace distance 35µm 0,15mm 0,10mm
Smallest trace distance 70µm not possible 0,20mm
Smallest drill-pad 0,60mm 0,50mm
Smallest clearance to inner slots 0,25mm 0,20mm or 0,0mm (plated)
Smallest clearance to outline 0,25mm 0,20mm or 0,0mm (plated)
Copper layers (outer) - rigid-flexible printed circuitsOnline calculationOn explicit enquiry
Smallest trace width 35µm not possible 0,10mm
Smallest trace width 70µm not possible 0,20mm
Smallest trace distance 35µm not possible 0,10mm
Smallest trace distance 70µm not possible 0,20mm
Smallest drill-pad not possible 0,40mm
Smallest clearance to inner outline not possible 0,30mm
Smallest clearance to inner slots not possible 0,35mm
Smallest clearance to inner drills not possible 0,30mm
Solder mask - rigid-flexible printed circuitsOnline calculationOn explicit enquiry
Smallest solder mask bridge (straight) 0,10mm 0,08mm
Smallest solder mask bridge  (round) 0,05mm 0,05mm
Smallest clearance 0,05mm <0mm
Smallest text size 0,25mm 0,25mm
Cover-lay (punched / drilled / lasered) - rigid-flexible printed circuitsOnline calculationOn explicit enquiry
Smallest rectangular pad  5x5mm 2x2mm
Smallest web bridge (rectangular) 5,0mm 2,0mm
Smallest web bridge  (round) 3,0mm 1,0mm
Smallest clearance 0,2mm <0mm
Smallest text size not possible not possible
Silk print - rigid-flexible printed circuitsOnline calculationOn explicit enquiry
Smallest text size 0,20mm 0,15mm
Smallest text distance 0,20mm 0,15mm
Minimum clearance to pads 0,20mm 0,15mm
Carbon print - rigid-flexible printed circuitsOnline calculationOn explicit enquiry
Minimum pad distance not possible 0,50mm
Tolerances, values, markings & standards - rigid-flexible printed circuitsOnline calculationOn explicit enquiry
Max. deviation between centre of drill and target 0,10mm 0,075mm
Max. offset solder mask to copper 0,20mm 0,10mm
Drill diameter PTH (<=3mm) -0,05/+0,10mm -0/+0,10mm
Drill diameter PTH (>3mm) -0,05/+0,10mm -0/+0,10mm
Drill diameter NPTH (<=6mm) -0,05/+0,10mm -0/+0,10mm
Drill diameter NPTH (>6mm) -0,05/+0,10mm -0/+0,10mm
Outline +/-0,30mm +/-0,10mm
Max. offset copper to outinline +/-0,30mm +/-0,10mm
V-cut depth not possible +/-0,20mm
Max. offset v-cut to copper not possible +/-0,20mm
Etching tolerance (trace width) 35µm +0/-0,03mm +0/-0,03mm
Etching tolerance (trace width) 70µm not possible +0/-0,04mm
Material thickness tolerance +/-15% varies, please enquire
Copper thickness tolerance +/-15% +/-10%
Immersion tin thickness not possible not possible
HAL lead-free thickness not possible not possible
Immersion gold, ENIG (nickel thickness) 2,5µm to 5µm 2,5µm to 5µm
Immersion gold, ENIG (gold thickness) 0,025µm to 0,075µm 0,05µm to 0,075µm
Immersion gold, ENEPIG (nickel thickness) not possible 2,5µm to 5µm
Immersion gold, ENEPIG (gold thickness) not possible 0,025µm to 0,05µm
Elect. gold - soft, bonding (nickel thickness) not possible not possible
Elect. gold - soft, bonding (gold thickness) not possible not possible
Elect. connector gold - hard, no bonding (nickel thickness) not possible 4µm to 8µm
Elect. connector gold - hard, no bonding (gold thickness) not possible 0,8µm to 1,2µm
Solder mask thickness ca. 10µm >15µm
Cover-lay thickness 25,4µm ab 12,5µm
Thickness of adhesive polyimide-basefilm to copper (epoxy) 25,4µm ab 12,5µm
Thickness of adhesive polyimide-cover-lay to copper (epoxy) 25,4µm ab 12,5µm
Copper wall 35µm min. 18µm min. 20µm
Copper wall 70µm not possible min. 20µm
Connector tolerance with stiffener (total width) not possible +/-0,10mm
Connector tolerance with stiffener (pad to outline) not possible +/-0,10mm
Beveling angle not possible 45° / 60°
Base material RoHS-complian yes, always yes, always
Surface finish RoHS-complian yes, always yes, always
IPC-standard class 2 IPC-6013 - class 1, 2 or 3
UL-approval of RFPCB (UL-number, logo, date code) not possible not possible
UL-approval of base materials possible possible
Adding date code (WW/YY) possible, please mention in comments possible, please mention in comments
Adding company logo (LeitOn) possible, please mention in comments possible, please mention in comments
DIN EN ISO 9001 certification of LeitOn GmbH yes yes
DIN EN ISO 14001 certification of LeitOn GmbH no possible
DIN EN ISO 16949 certification no possible

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