Technology and design rules
for rigid flexible printed circuits
Downloads
| Name | Type | Size | Download |
|---|---|---|---|
| Stackup SF A1 2-layer - Standard online calculation(47,61 KB, PDF) | 48 KB | Download | |
| Stackup SF A1 4-layer - Standard online calculation(48,27 KB, PDF) | 48 KB | Download | |
| Stackup SF A1 6-layer - Standard online calculation(49,18 KB, PDF) | 49 KB | Download |
| Options and characteristics - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
|---|---|---|
| Quantities | 1 piece to max. 0,4m² total area | 1 piece to mass prodcuction |
| Layer count (total) | 2-, 4- and 6-layers | up to 12 layers |
| Layer count (flexible) | 2-, 4- und 6-Lagen | up to 4 layer |
| Flex layer position | outer | outer and inner |
| Material thickness | 1,2 / 1,6 / 2,0mm | 0,5 bis 3,2mm |
| Kupferdicke (Basis) | 35µm | 35 / 70µm |
| Material color | beige / red-brown (oolyimide) | beige / red-brown (polyimide) |
| Base material type | FR4 with oolyimide and epoxy adhesive | FR4 with polyimide and epoxy adhesive |
| Maximum operating temeprature | ca. 120° C | ca. 120° C |
| Copper type | no selection | ED- or RA-copper |
| Silk print layers | none, top, bottom, double-sided | none, top, bottom, double-sided |
| Solder mask colors | green | yellow, green, white, red, blue, black |
| Cover-lay | yellow polyimide |
yellow, black or white polyimide |
| Combination of cover-lay and solder mask | possible | possible |
| Sil print color | white | white, black, blue, yellow, green, red |
| Via-filler (no copper-lid) | possible by cover-lay | possible by cover-lay |
| Stiffener | possible | variety of thicknesses, FR4 or polyimide, standard ZIF/LIF connectors 0,30mm +/-0,05mm |
| 3M-adhesive | not possible | possible |
| Electrical test | possible | not possible |
| Plugging (with copper-lid, e.g. for "via-in-pad") | not possible | possible with inner-flex-layers |
| Peelable mask | not possible | possible |
| Beveling | not possible | possible (rigid area) |
| Surface finish | immersion gold ENIG | immersion gold ENIG or ENEPIG |
| Connector gold | not possible | possible |
| Long term baking | not possible | possible |
| Maximum PCB size 2-layer | 235x370mm² | depends on specifications, please enquire |
| Maximum PCB size 4- and 6-layer | 235x370mm² | depends on specifications, please enquire |
| Lead time options 2-layer | 10WD, 15WD, 20WD | <10WD |
| Lead time options 4- and 6-layer | 10WD, 15WD, 20WD | <10WD |
| Routing | included | included |
| V-cut | not possible | possible, in rigid area |
| Jump v-cut | not possible | possible, in rigid area |
| Punching | not possible | not possible |
| Counter-sink drills | not possible | possible |
| Special multilayer stack-ups | not possible | possible |
| Panelization - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
|---|---|---|
| V-cut-panel | not possible | possible |
| V-cut-punching-panel | not possible | not possible |
| Multy-panel (more than 1 layout) | not possible | possible |
| Panelization (chosen by LeitOn) | possible | possible |
| Panelization (according to drawing, prepared by LeitOn) | possible | possible |
| PTH-Drills (plated) - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
|---|---|---|
| Smallest drill | 0,30mm | 0,20mm |
| Smallest annular ring | 0,15mm | 0,10mm |
| Drill sizes | up to 5,5mm in 0,05mm steps | up to 5,5mm in 0,05mm steps |
| Drills >5,5mm | routing | routing |
| Min. hole distance 0,2mm to 2,0mm drill diameter | 0,50mm | 0,40mm |
| Min. hole distance 2,05mm to 5,5mm drill diameter | 0,60mm | 0,50mm |
| Min. distance PTH-drill to flexible layer | 1,00mm | 0,80mm |
| Intersecting drills | not possible | not possible |
| Half-open PTH | not possible | not possible |
| PTH in flexible area | not possible | possible |
| NPTH-Drills (non-plated) - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
|---|---|---|
| Smallest drill | 0,30mm | 0,20mm |
| Drill sizes | 0,30mm to 5,5mm in 0,05mm steps | 0,20mm to 5,5mm in 0,05mm steps |
| Distance to copper areas | 0,25mm | 0,20mm |
| Drills >5,5mm | routing | routing |
| Min. distance to outline | 0,60mm | 0,50mm |
| Min. hole distance 0,2mm to 2,0mm drill diameter | 0,50mm | 0,40mm |
| Min. hole distance 2,05mm to 5,5mm drill diameter | 0,60mm | 0,50mm |
| Intersecting drills | not possible | nicht möglich |
| NPTH in copper areas | not possible(0,2mm clearance will be applied) | on explicit enquiry |
| Blind vias - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
|---|---|---|
| Smallest blind via (final) | not possible | 0,10mm |
| Smallest aspect-ratio | not possible | 1:1 |
| Smallest annular ring | not possible | 0,15mm |
| Buried vias - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
|---|---|---|
| Smallest buried via | not possible | 0,10mm |
| Slots (non-plated) - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
|---|---|---|
| Inner routing / slots (NPTH) | possible | possible |
| Smallest routing / slots (NPTH) | from 1,0mm up | from 0,6mm up |
| Smallest routing radious (NPTH) | 0,5mm | 0,3mm |
| Slots (plated) - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
|---|---|---|
| Plated slots (PTH) | not possible | possible |
| Smallest plated slot | not possible | from 0,7mm |
| Plated outline | not possible | not possible |
| Special slot shapes, plated (inner) | not possible | possible |
| Smallest radius, plated | not possible | 0,3mm |
| Smallest annular ring | not possible | 0,15mm |
| Copper layers (outer) - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
|---|---|---|
| Smallest trace width 35µm | 0,15mm | 0,10mm |
| Smallest trace width 70µm | not possible | 0,20mm |
| Smallest trace distance 35µm | 0,15mm | 0,10mm |
| Smallest trace distance 70µm | not possible | 0,20mm |
| Smallest drill-pad | 0,60mm | 0,50mm |
| Smallest clearance to inner slots | 0,25mm | 0,20mm or 0,0mm (plated) |
| Smallest clearance to outline | 0,25mm | 0,20mm or 0,0mm (plated) |
| Copper layers (outer) - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
|---|---|---|
| Smallest trace width 35µm | not possible | 0,10mm |
| Smallest trace width 70µm | not possible | 0,20mm |
| Smallest trace distance 35µm | not possible | 0,10mm |
| Smallest trace distance 70µm | not possible | 0,20mm |
| Smallest drill-pad | not possible | 0,40mm |
| Smallest clearance to inner outline | not possible | 0,30mm |
| Smallest clearance to inner slots | not possible | 0,35mm |
| Smallest clearance to inner drills | not possible | 0,30mm |
| Solder mask - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
|---|---|---|
 Smallest solder mask bridge (straight) |
0,10mm | 0,08mm |
 Smallest solder mask bridge (round) |
0,05mm | 0,05mm |
 Smallest clearance |
0,05mm | <0mm |
| Smallest text size | 0,25mm | 0,25mm |
| Cover-lay (punched / drilled / lasered) - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
|---|---|---|
| Smallest rectangular pad | 5x5mm | 2x2mm |
| Smallest web bridge (rectangular) |
5,0mm | 2,0mm |
| Smallest web bridge (round) |
3,0mm | 1,0mm |
| Smallest clearance |
0,2mm | <0mm |
| Smallest text size | not possible | not possible |
| Silk print - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
|---|---|---|
| Smallest text size | 0,20mm | 0,15mm |
| Smallest text distance | 0,20mm | 0,15mm |
| Minimum clearance to pads | 0,20mm | 0,15mm |
| Carbon print - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
|---|---|---|
| Minimum pad distance | not possible | 0,50mm |
| Tolerances, values, markings & standards - rigid-flexible printed circuits | Online calculation | On explicit enquiry |
|---|---|---|
| Max. deviation between centre of drill and target | 0,10mm | 0,075mm |
| Max. offset solder mask to copper | 0,20mm | 0,10mm |
| Drill diameter PTH (<=3mm) | -0,05/+0,10mm | -0/+0,10mm |
| Drill diameter PTH (>3mm) | -0,05/+0,10mm | -0/+0,10mm |
| Drill diameter NPTH (<=6mm) | -0,05/+0,10mm | -0/+0,10mm |
| Drill diameter NPTH (>6mm) | -0,05/+0,10mm | -0/+0,10mm |
| Outline | +/-0,30mm | +/-0,10mm |
| Max. offset copper to outinline | +/-0,30mm | +/-0,10mm |
| V-cut depth | not possible | +/-0,20mm |
| Max. offset v-cut to copper | not possible | +/-0,20mm |
| Etching tolerance (trace width) 35µm | +0/-0,03mm | +0/-0,03mm |
| Etching tolerance (trace width) 70µm | not possible | +0/-0,04mm |
| Material thickness tolerance | +/-15% | varies, please enquire |
| Copper thickness tolerance | +/-15% | +/-10% |
| Immersion tin thickness | not possible | not possible |
| HAL lead-free thickness | not possible | not possible |
| Immersion gold, ENIG (nickel thickness) | 2,5µm to 5µm | 2,5µm to 5µm |
| Immersion gold, ENIG (gold thickness) | 0,025µm to 0,075µm | 0,05µm to 0,075µm |
| Immersion gold, ENEPIG (nickel thickness) | not possible | 2,5µm to 5µm |
| Immersion gold, ENEPIG (gold thickness) | not possible | 0,025µm to 0,05µm |
| Elect. gold - soft, bonding (nickel thickness) | not possible | not possible |
| Elect. gold - soft, bonding (gold thickness) | not possible | not possible |
| Elect. connector gold - hard, no bonding (nickel thickness) | not possible | 4µm to 8µm |
| Elect. connector gold - hard, no bonding (gold thickness) | not possible | 0,8µm to 1,2µm |
| Solder mask thickness | ca. 10µm | >15µm |
| Cover-lay thickness | 25,4µm | ab 12,5µm |
| Thickness of adhesive polyimide-basefilm to copper (epoxy) | 25,4µm | ab 12,5µm |
| Thickness of adhesive polyimide-cover-lay to copper (epoxy) | 25,4µm | ab 12,5µm |
| Copper wall 35µm | min. 18µm | min. 20µm |
| Copper wall 70µm | not possible | min. 20µm |
| Connector tolerance with stiffener (total width) | not possible | +/-0,10mm |
| Connector tolerance with stiffener (pad to outline) | not possible | +/-0,10mm |
| Beveling angle | not possible | 45° / 60° |
| Base material RoHS-complian | yes, always | yes, always |
| Surface finish RoHS-complian | yes, always | yes, always |
| IPC-standard | class 2 | IPC-6013 - class 1, 2 or 3 |
| UL-approval of RFPCB (UL-number, logo, date code) | not possible | not possible |
| UL-approval of base materials | possible | possible |
| Adding date code (WW/YY) | possible, please mention in comments | possible, please mention in comments |
| Adding company logo (LeitOn) | possible, please mention in comments | possible, please mention in comments |
| DIN EN ISO 9001 certification of LeitOn GmbH | yes | yes |
| DIN EN ISO 14001 certification of LeitOn GmbH | no | possible |
| DIN EN ISO 16949 certification | no | possible |
