Technology and design rulesfor rigid flexible printed circuits
Downloads Other stack-ups available on enquiry !
Options and characteristics - rigid-flexible printed circuits Online calculation On explicit enquiry
Quantities
1 piece to max. 0,4m² total area
1 piece to mass prodcuction
Layer count (total)
2-, 4- and 6-layers
up to 12 layers
Layer count (flexible) 2-, 4- und 6-Lagen
up to 4 layer
Flex layer position
outer
outer and inner
Material thickness
1,2 / 1,6 / 2,0mm
0,5 bis 3,2mm
Kupferdicke (Basis)
35µm
35 / 70µm
Material color
beige / red-brown (oolyimide)
beige / red-brown (polyimide)
Base material type
FR4 with oolyimide and epoxy adhesive
FR4 with polyimide and epoxy adhesive
Maximum operating temeprature
ca. 120° C
ca. 120° C
Copper type
no selection
ED- or RA-copper
Silk print layers
none, top, bottom, double-sided
none, top, bottom, double-sided
Solder mask colors
green
yellow, green, white, red, blue, black
Cover-lay
yellow polyimide
yellow, black or white polyimide
Combination of cover-lay and solder mask
possible
possible
Sil print color
white
white, black, blue, yellow, green, red
Via-filler (no copper-lid)
possible by cover-lay
possible by cover-lay
Stiffener
possible
variety of thicknesses, FR4 or polyimide, standard ZIF/LIF connectors 0,30mm +/-0,05mm
3M-adhesive
not possible
possible
Electrical test
possible
not possible
Plugging (with copper-lid, e.g. for "via-in-pad")
not possible
possible with inner-flex-layers
Peelable mask
not possible possible
Beveling
not possible possible (rigid area)
Surface finish
immersion gold ENIG
immersion gold ENIG or ENEPIG
Connector gold
not possible possible
Long term baking
not possible possible
Maximum PCB size 2-layer
235x370mm²
depends on specifications, please enquire
Maximum PCB size 4- and 6-layer 235x370mm² depends on specifications, please enquire
Lead time options 2-layer
10WD, 15WD, 20WD
<10WD
Lead time options 4- and 6-layer 10WD, 15WD, 20WD <10WD
Routing
included
included
V-cut
not possible possible , in rigid area
Jump v-cut
not possible possible , in rigid area
Punching
not possible not possible
Counter-sink drills
not possible possible
Special multilayer stack-ups
not possible possible
Panelization - rigid-flexible printed circuits Online calculation On explicit enquiry
V-cut-panel
not possible possible
V-cut-punching-panel
not possible not possible
Multy-panel (more than 1 layout)
not possible possible
Panelization (chosen by LeitOn)
possible possible
Panelization (according to drawing, prepared by LeitOn)possible possible
PTH-Drills (plated) - rigid-flexible printed circuits Online calculation On explicit enquiry
Smallest drill
0,30mm
0,20mm
Smallest annular ring
0,15mm
0,10mm
Drill sizes
up to 5,5mm in 0,05mm steps
up to 5,5mm in 0,05mm steps
Drills >5,5mm
routing
routing
Min. hole distance 0,2mm to 2,0mm drill diameter
0,50mm
0,40mm
Min. hole distance 2,05mm to 5,5mm drill diameter 0,60mm
0,50mm
Min. distance PTH-drill to flexible layer
1,00mm
0,80mm
Intersecting drills
not possible not possible
Half-open PTH
not possible not possible
PTH in flexible area
not possible possible
NPTH-Drills (non-plated) - rigid-flexible printed circuits Online calculation On explicit enquiry
Smallest drill
0,30mm
0,20mm
Drill sizes
0,30mm to 5,5mm in 0,05mm steps
0,2 0mm to 5,5mm in 0,05mm steps
Distance to copper areas
0,25mm
0,20mm
Drills >5,5mm
routing
routing
Min. distance to outline
0,60mm
0,50mm
Min. hole distance 0,2mm to 2,0mm drill diameter 0,50mm
0,40mm
Min. hole distance 2,05mm to 5,5mm drill diameter 0,60mm
0,50mm
Intersecting drills not possible nicht möglich
NPTH in copper areas
not possible (0,2mm clearance will be applied)on explicit enquiry
Blind vias - rigid-flexible printed circuits Online calculation On explicit enquiry
Smallest blind via (final)
not possible 0,10mm
Smallest aspect-ratio
not possible 1:1
Smallest annular ring
not possible 0,15mm
Buried vias - rigid-flexible printed circuits Online calculation On explicit enquiry
Smallest buried via
not possible 0,10mm
Slots (non-plated) - rigid-flexible printed circuits Online calculation On explicit enquiry
Inner routing / slots (NPTH)
possible possible
Smallest routing / slots (NPTH) from 1,0mm up
from 0,6mm up
Smallest routing radious (NPTH) 0,5mm
0,3mm
Slots (plated) - rigid-flexible printed circuits Online calculation On explicit enquiry
Plated slots (PTH) not possible possible
Smallest plated slot
not possible from 0,7mm
Plated outline
not possible not possible
Special slot shapes, plated (inner)
not possible possible
Smallest radius, plated
not possible 0,3mm
Smallest annular ring
not possible 0,15mm
Copper layers (outer) - rigid-flexible printed circuits Online calculation On explicit enquiry
Smallest trace width 35µm
0,15mm
0,10mm
Smallest trace width 70µm
not possible 0,20mm
Smallest trace distance 35µm 0,15mm
0,10mm
Smallest trace distance 70µm not possible 0,20mm
Smallest drill-pad
0,60mm
0,50mm
Smallest clearance to inner slots
0,25mm
0,20mm or 0,0mm (plated)
Smallest clearance to outline 0,25mm
0,20mm or 0,0mm (plated)
Copper layers (outer) - rigid-flexible printed circuits Online calculation On explicit enquiry
Smallest trace width 35µm not possible 0,10mm
Smallest trace width 70µm not possible 0,20mm
Smallest trace distance 35µm not possible 0,10mm
Smallest trace distance 70µm not possible 0,20mm
Smallest drill-pad not possible 0,40mm
Smallest clearance to inner outline not possible 0,30mm
Smallest clearance to inner slots not possible 0,35mm
Smallest clearance to inner drills not possible 0,30mm
Solder mask - rigid-flexible printed circuits Online calculation On explicit enquiry
0,10mm
0,08mm
Smallest solder mask bridge (round)0,05mm
0,05mm
0,05mm
<0mm
Smallest text size
0,25mm
0,25mm
Cover-lay (punched / drilled / lasered) - rigid-flexible printed circuits Online calculation On explicit enquiry
Smallest rectangular pad
5x5mm
2x2mm
5,0mm
2,0mm
Smallest web bridge (round)3,0mm
1,0mm
0,2mm
<0mm
Smallest text size not possible not possible
Silk print - rigid-flexible printed circuits Online calculation On explicit enquiry
Smallest text size 0,20mm
0,15mm
Smallest text distance 0,20mm
0,15mm
Minimum clearance to pads
0,20mm
0,15mm
Carbon print - rigid-flexible printed circuits Online calculation On explicit enquiry
Minimum pad distance
not possible 0,50mm
Tolerances, values, markings & standards - rigid-flexible printed circuits Online calculation On explicit enquiry
Max. deviation between centre of drill and target
0,10mm
0,075mm
Max. offset solder mask to copper
0,20mm
0,10mm
Drill diameter PTH (<=3mm)
-0,05/+0,10mm
-0/+0,10mm
Drill diameter PTH (>3mm)
-0,05/+0,10mm
-0/+0,10mm
Drill diameter NPTH (<=6mm)-0,05/+0,10mm
-0/+0,10mm
Drill diameter NPTH (>6mm)-0,05/+0,10mm
-0/+0,10mm
Outline
+/-0,30mm
+/-0,10mm
Max. offset copper to outinline
+/-0,30mm
+/-0,10mm
V-cut depth
not possible +/-0,20mm
Max. offset v-cut to copper
not possible +/-0,20mm
Etching tolerance (trace width) 35µm
+0/-0,03mm
+0/-0,03mm
Etching tolerance (trace width) 70µmnot possible +0/-0,04mm
Material thickness tolerance
+/-15%
varies, please enquire
Copper thickness tolerance
+/-15%
+/-10%
Immersion tin thickness
not possible not possible
HAL lead-free thickness
not possible not possible
Immersion gold, ENIG (nickel thickness)
2,5µm to 5µm
2,5µm to 5µm
Immersion gold, ENIG (gold thickness) 0,025µm to 0,075µm
0,05µm to 0,075µm
Immersion gold, ENEPIG (nickel thickness) not possible 2,5µm to 5µm
Immersion gold, ENEPIG (gold thickness) not possible 0,025µm to 0,05µm
Elect. gold - soft, bonding (nickel thickness)
not possible not possible
Elect. gold - soft, bonding (gold thickness)not possible not possible
Elect. connector gold - hard, no bonding (nickel thickness) not possible 4µm to 8µm
Elect. connector gold - hard, no bonding (gold thickness) not possible 0,8µm to 1,2µm
Solder mask thickness
ca. 10µm
>15µm
Cover-lay thickness
25,4µm
ab 12,5µm
Thickness of adhesive polyimide-basefilm to copper (epoxy)
25,4µm
ab 12,5µm
Thickness of adhesive polyimide-cover-lay to copper (epoxy) 25,4µm
ab 12,5µm
Copper wall 35µm
min. 18µm
min. 20µm
Copper wall 70µm
not possible min. 20µm
Connector tolerance with stiffener (total width)
not possible +/-0,10mm
Connector tolerance with stiffener (pad to outline) not possible +/-0,10mm
Beveling angle
not possible 45° / 60°
Base material RoHS-complian
yes, always
yes, always
Surface finish RoHS-complian
yes, always yes, always
IPC-standard
class 2
IPC-6013 - class 1, 2 or 3
UL-approval of RFPCB (UL-number, logo, date code)
not possible not possible
UL-approval of base materials possible
possible
Adding date code (WW/YY)
possible, please mention in comments
possible, please mention in comments
Adding company logo (LeitOn)
possible, please mention in comments possible, please mention in comments
DIN EN ISO 9001 certification of LeitOn GmbH
yes
yes
DIN EN ISO 14001 certification of LeitOn GmbH
no
possible
DIN EN ISO 16949 certification
no
possible
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Smallest solder mask bridge (straight)
Smallest solder mask bridge (round)
Smallest clearance
